BofA on CXMT's 4F2 architecture:

Restricted from importing ASML’s EUV lithography tools due to US sanctions, CXMT is likely advancing toward 4F2 architecture faster than the "Big 3" DRAM manufacturers.

While the top three producers have already shifted to EUV-based 6F2 designs at low- to mid-10nm nodes and have researched 4F2 for over a decade, they have avoided mass production.

This hesitation stems from poor manufacturing yields, steep costs, and technical challenges—such as extreme heat and structural fragility when cramming billions of transistors and capacitors into a compact die.

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