---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/42839789.md"
description: "Former Senior Post Silicon Validation Engineer at NVIDIA on CPO:"Eventually, CPO is where the technology is converging and going to converge. Whoever comes with a reliable CPO product first, they will see a huge demand. There is absolutely no doubt about that. All these NPO and LPO are temporary compromise, for the lack of a better word."Current State & Commercial Timeline> Experimental Phase: CPO technology is currently in pilot and experimental stages, with no commercial products available yet.  > Timeline for Adoption: Initial CPO products are tentatively expected around 2028, though unexpected delays could occur due to major, unresolved engineering hurdles.  > Demand Dynamics: Once CPO is successfully and reliably commercialized, demand will experience an explosive surge, limited only by production supply rather than market interest.  Key Technical Hurdles> Thermal Management: Compute chips generate kilowatts of heat, whereas optical engines are exceptionally sensitive to temperature changes (even minor shifts can alter laser wavelengths).  > Glass Substrates & Via Drilling: Transitioning from traditional organic substrates to glass is necessary for scale, but drilling microscopic, precise vias into glass without causing micro-cracking remains a massive challenge.  > Laser Integration: Internal laser setups face severe thermal interference from compute chips, while external laser setups struggle with high optical loss when trying to focus light onto extremely thin substrate layers. Competitive & Technological Landscape> Interim Solutions: Technologies like NPO (Near-Packaged Optics) and LPO (Linear Drive Pluggable Optics) are viewed as temporary compromises; once CPO matures, the industry will fully converge on it, causing demand for traditional pluggables to decline.  > Key Players: Major industry stakeholders—including TSMC, Samsung, Intel, and Amkor—are heavily investing in packaging R&D, with TSMC viewed as a dominant pioneer via solutions like CoWoS and CoPoS.  > Laser & Component Suppliers: Lumentum is positioned well ahead of competitors in the optical landscape, supported by strategic partnerships and investments (such as NVIDIA's capital backing).Bill of Materials (BOM) Breakdown> Packaging: Forms the largest share of the CPO BOM (~50% to 55%) and represents the hardest problem to commoditize.  > Light Sources / Lasers: Accounts for roughly one-third of the BOM.  > Cooling Solutions: Makes up the remaining portion, playing an equally vital role due to severe thermal constraints. Optical Circuit Switching (OCS)> Role in Future Infrastructure: Once signals are converted to light via CPO, OCS will become critical to route traffic dynamically across large clusters of GPUs without re-converting signals back to electrical (which destroys power-saving benefits).  > Current Limitations: Existing OCS solutions lack packet-decoding capabilities and rely on rigid, round-robin scheduling schemes, meaning optical switching technology must heavily evolve alongside CPO. $Marvell Tech(MRVL.US) $Amkor Tech(AMKR.US) $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Marvell Tech(MRVL.US) $Lumentum(LITE.US) $Intel(INTC.US) $Applied Optoelectronics(AAOI.US)"
datetime: "2026-07-22T00:11:53.000Z"
locales:
  - [en](https://longbridge.com/en/topics/42839789.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/42839789.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/42839789.md)
author: "[Equity research](https://longbridge.com/en/profiles/2071818324550963200.md)"
---

# Former Senior Post Silicon Validation Engineer at …


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