---
title: "SINOPACK: The silicon carbide chip wafer process line is in the product upgrade and customer introduction stage"
type: "News"
locale: "zh-CN"
url: "https://longbridge.com/zh-CN/news/258736744.md"
description: "SINOPACK released the record of investor relations activities, announcing that the silicon carbide chip wafer process line has completed the upgrade from 6 inches to 8 inches and is currently in the product upgrade and customer introduction phase. At the same time, the new product development of ceramic components has made phased progress and has achieved mass supply. The transmission rate of optical communication device housings covers multiple levels and has achieved mass production, actively developing 3.2Tbps products. In addition, aluminum nitride multilayer thick and thin film products have experienced rapid growth in high-frequency and high-speed optical modules, applied in new scenarios such as AI intelligence and data centers"
datetime: "2025-09-24T15:10:35.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/258736744.md)
  - [en](https://longbridge.com/en/news/258736744.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/258736744.md)
---

> 支持的语言: [English](https://longbridge.com/en/news/258736744.md) | [繁體中文](https://longbridge.com/zh-HK/news/258736744.md)


# SINOPACK: The silicon carbide chip wafer process line is in the product upgrade and customer introduction stage

SINOPACK released the investor relations activity record form. In the first half of 2025, the silicon carbide chip wafer process line will be upgraded from 6 inches to 8 inches, and it is currently in the product upgrade and customer introduction stage. The new product development of ceramic components has achieved phased progress, having passed verification on domestic semiconductor equipment and achieved mass supply. The company's optical communication device shell transmission rates have covered 2.5Gbps, 10Gbps, 25Gbps, 100Gbps, 200Gbps, 400Gbps, 800Gbps, and 1.6Tbps, all of which have achieved mass production. The company is currently actively cooperating with customers in the research and development of 3.2Tbps products. In addition, the company's aluminum nitride multilayer thin and thick film products have achieved rapid growth, with applications in high-frequency and high-speed optical modules, and are being used in new scenarios such as AI intelligence and data centers

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