---
title: "It is reported that Huawei's top AI chips use components from Taiwan Semiconductor, Samsung, and SK Hynix"
type: "News"
locale: "zh-CN"
url: "https://longbridge.com/zh-CN/news/259873022.md"
description: "Huawei's flagship AI chip Ascend 910C uses components from Taiwan Semiconductor, Samsung, and SK Hynix, indicating that China still relies on foreign hardware for AI chip production. Research by TechInsights shows that the chips provided by Taiwan Semiconductor are older models and have not been supplied to Huawei since September 2020, emphasizing compliance with export controls"
datetime: "2025-10-03T08:48:39.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/259873022.md)
  - [en](https://longbridge.com/en/news/259873022.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/259873022.md)
---

> 支持的语言: [English](https://longbridge.com/en/news/259873022.md) | [繁體中文](https://longbridge.com/zh-HK/news/259873022.md)


# It is reported that Huawei's top AI chips use components from Taiwan Semiconductor, Samsung, and SK Hynix

Research company TechInsights disassembled Huawei's flagship Ascend 910C chip and stated that the chip contains components from Taiwan Semiconductor (TSM.US), Samsung, and SK Hynix, indicating that China still has a certain degree of reliance on foreign hardware while promoting domestic AI chip production.

Among several samples of the Ascend 910C chip, chips manufactured by Taiwan Semiconductor were found, as well as older generation high bandwidth memory (HBM2E) produced by Samsung and SK Hynix.

Taiwan Semiconductor issued a statement indicating that the chip appears to be made using the company's older chips rather than more recently produced chips or other more advanced technologies, emphasizing that the company complies with all export controls and has not supplied Huawei since mid-September 2020

### 相关股票

- [Taiwan Semiconductor (TSM.US)](https://longbridge.com/zh-CN/quote/TSM.US.md)
- [Huawei (HUAWEI.NA)](https://longbridge.com/zh-CN/quote/HUAWEI.NA.md)

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