---
title: "台积电的新厂 Fab 25 预计将在 2028 年开始生产 A14 芯片"
description: "台积电已提交其位于台中的新 Fab 25 设施的建设许可证，计划在 2028 年下半年生产下一代 A14 芯片。A14 工艺将采用台积电的 NanoFlex Pro 架构，提供显著的性能和效率提升。该项目涉及约 490 亿美元的投资，预计在完成后将创造约 4500 个就业机会"
type: "news"
locale: "zh-CN"
url: "https://longbridge.com/zh-CN/news/261808056.md"
published_at: "2025-10-20T03:58:45.000Z"
---

# 台积电的新厂 Fab 25 预计将在 2028 年开始生产 A14 芯片

> 台积电已提交其位于台中的新 Fab 25 设施的建设许可证，计划在 2028 年下半年生产下一代 A14 芯片。A14 工艺将采用台积电的 NanoFlex Pro 架构，提供显著的性能和效率提升。该项目涉及约 490 亿美元的投资，预计在完成后将创造约 4500 个就业机会

根据官方文件和媒体报道，台积电已向当地科技园区管理局提交了其新建 Fab 25 设施的建设许可证。该晶圆厂将作为公司下一代 A14 工艺的关键生产基地，计划于 2028 年下半年实现量产。

A14 工艺采用了台积电的 NanoFlex Pro 标准单元架构，相比 N2 工艺在全节点性能和效率上有显著提升——在相同功耗下速度提高了 15%，或在相同速度下功耗降低了 30%，逻辑密度提高超过 20%。该项目总投资约为 490 亿美元，预计在全面运营后将创造约 4500 个就业岗位。

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> **免责声明**：本文内容仅供参考，不构成任何投资建议。