<p><strong>联合新闻稿</strong></p>
<p><strong>2025 年 12 月 11 日</strong></p>
<p><strong>卢森堡 / 日内瓦</strong></p>
<p><strong>欧洲投资银行与意法半导体宣布达成 10 亿欧元协议，以提升欧洲的竞争力和战略自主性</strong></p>
<ul>
<li><strong>信贷额度旨在加强欧洲半导体产业，并支持符合欧盟目标的创新、可持续性和能源效率</strong></li>
<li><strong>首个 5 亿欧元的分期贷款已签署，以支持意大利和法国的研发加速及大规模芯片制造。</strong></li>
<li><strong>这项新协议是欧洲投资银行与意法半导体之间的第九项协议，使总融资额达到约 42 亿欧元</strong></li>
</ul>
<p>欧洲投资银行（EIB）与意法半导体（NYSE:STM，简称 “ST”）签署了一项 5 亿欧元的融资协议，以提升欧洲的竞争力和战略自主性。这是 EIB 最近批准的针对意法半导体的更大规模 10 亿欧元信贷额度的首个分期贷款。意法半导体是一家在欧洲（包括意大利、法国和马耳他）具有强大影响力的领先半导体制造商，服务于汽车、工业、个人电子和通信基础设施市场。</p>
<p>自 1994 年以来，EIB 已支持与 ST 的九个项目，融资总额约为 42 亿欧元。这项新业务将支持 ST 在意大利和法国的创新半导体技术和设备投资计划，ST 在这两个国家同时开展研发和大规模制造。协议中约 60% 的资金将用于大规模制造能力，包括卡塔尼亚、阿格拉泰和克罗莱斯等关键地点，其余 40% 则专注于研发。</p>
<p>“欧洲在半导体创新方面的领导能力对我们的竞争力、韧性和气候目标至关重要。这项协议反映了 EIB 对支持战略产业的承诺，这些产业能够促进绿色和数字转型，并增强欧洲的技术主权，”<strong>EIB 副行长 Gelsomina Vigliotti</strong> 表示。</p>
<p>“ST 继续致力于加强欧洲的半导体生态系统，而 EIB 的这笔重要贷款旨在增强我们在意大利和法国各个地点的研发和大规模制造的努力，”<strong>意法半导体总裁兼首席执行官 Jean-Marc Chery</strong> 表示。“ST 与 EIB 的长期合作强调了我们确保欧洲在全球半导体市场中技术领导地位的承诺。”</p>
<p>“半导体是现代经济的核心，驱动着从电动车到数字基础设施的一切。通过为 ST 在研究和先进制造方面的投资提供融资，我们正在帮助欧洲确保关键技术，并为未来创造高技能就业机会，”<strong>EIB 副行长 Ambroise Fayolle</strong> 补充道。</p>
<p>今天宣布的协议是在上周 EIB 高层代表团访问 ST 位于卡塔尼亚的设施后达成的，该设施是一个涵盖整个碳化硅（SiC）价值链的先进工厂，是欧盟银行融资的关键组成部分。</p>
<p><strong>一般信息</strong></p>
<p>欧洲投资银行（EIB）是欧盟的长期贷款机构，由其成员国拥有。我们围绕八个核心优先事项进行建设，融资那些通过加强气候行动和环境、数字化和技术创新、安全和防御、凝聚力、农业和生物经济、社会基础设施、资本市场联盟以及在一个更加和平和繁荣的世界中增强欧洲实力的投资。</p>
<p>EIB 集团还包括欧洲投资基金（EIF），在 2024 年签署了近 890 亿欧元的新融资，用于 900 多个高影响力项目，提升欧洲的竞争力和安全性。EIB 集团资助的所有项目均符合《巴黎气候协定》，正如我们在气候银行路线图中所承诺的那样。EIB 集团近 60% 的年度融资支持直接有助于气候变化缓解、适应和更健康环境的项目。</p>
<p>通过促进市场整合和动员投资，EIB 集团在 2024 年支持了超过 1000 亿欧元的新投资，以增强欧洲的能源安全，并为初创企业、成长型企业和欧洲先锋企业动员了 1100 亿欧元的增长资本。EIB 在欧盟内的融资约一半用于凝聚力地区，这些地区的人均收入低于欧盟平均水平。</p>
<p>我们总部的高质量、最新照片可供媒体使用，详见此处。</p>
<p><strong>关于意法半导体</strong></p>
<p>在意法半导体，我们是 50,000 名半导体技术的创造者和制造者，掌握着半导体供应链，拥有先进的制造设施。作为一家综合设备制造商，我们与超过 200,000 名客户和数千个合作伙伴合作，设计和构建产品、解决方案和生态系统，以应对他们的挑战和机遇，并支持一个更可持续的世界。我们的技术使更智能的出行、更高效的电力和能源管理以及云连接的自主设备的大规模部署成为可能。我们正朝着在所有直接和间接排放（范围 1 和 2）、产品运输、商务旅行和员工通勤排放（我们的范围 3 重点）中实现碳中和的目标迈进，并实现我们的</p>
<p>100%</p>
<p>可再生电力采购目标，预计到 2027 年底实现。</p>
<p><strong>联系方式</strong></p>
<p><strong>EIB</strong></p>
<p>EIB：Lorenzo Squintani</p>
<p>l.squintani@eib.org/press@eib.org</p>
<p>电话：+39 366 57 90 312</p>
<p>网站：www.eib.org/press</p>
<p><strong>ST</strong></p>
<p><em>投资者关系</em></p>
<p>Jérôme Ramel</p>
<p>企业发展与综合外部沟通执行副总裁</p>
<p>电话：+41.22.929.59.20</p>
<p>jerome.ramel@st.com</p>
<p><em>媒体关系</em></p>
<p>Alexis Breton</p>
<p>集团副总裁企业外部沟通</p>
<p>电话：+33.6.59.16.79.08</p>
<p>alexis.breton@st.com</p>
<ul>
<li>C3376C - 251211_EN_PR_EIB-STMicroelectronics_FINAL FOR PUBLICATION</li>
</ul>
<p><img src="https://imageproxy.pbkrs.com/https://www.globenewswire.com/newsroom/ti/query-bmY9TVRBd01URTBOREkxTkNNME1ESXlPREUxTURnak1qQXdNRGN3TlE9PQ?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://www.globenewswire.com/newsroom/ti/query-bmY9TVRBd01URTBOREkxTkNNME1ESXlPREUxTURnak1qQXdNRGN3TlE9PQ"/></p>
<p><img src="https://imageproxy.pbkrs.com/https://ml-eu.globenewswire.com/media/MGI1N2I5ZmQtNjhlYy00NmJjLTg2NjctYmRmZmY1YjBmY2JlLTEwMTIyNzgtMjAyNS0xMi0xMS1lbg==/tiny/STMicroelectronics-Internation.png?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://ml-eu.globenewswire.com/media/MGI1N2I5ZmQtNjhlYy00NmJjLTg2NjctYmRmZmY1YjBmY2JlLTEwMTIyNzgtMjAyNS0xMi0xMS1lbg==/tiny/STMicroelectronics-Internation.png"/></p>

意法半导体

<p>欧洲投资银行（EIB）与意法半导体（STMicroelectronics）签署了一项价值 10 亿欧元的协议，以增强欧洲的半导体产业，重点关注创新、可持续性和能源效率。首个 5 亿欧元的分期款将支持意大利和法国的研发及大规模芯片制造。这标志着 EIB 与 ST 的第九次合作，总融资额达到 42 亿欧元。该协议旨在加强欧洲的技术主权，并创造高技能就业机会，与欧盟的气候和数字目标相一致</p>

<p><strong>JOINT PRESS RELEASE</strong></p>
<div class="lb-trans"><p><strong>联合新闻稿</strong></p>
</div><p><strong>11 December 2025</strong></p>
<div class="lb-trans"><p><strong>2025 年 12 月 11 日</strong></p>
</div><p><strong>Luxembourg / Geneva</strong></p>
<div class="lb-trans"><p><strong>卢森堡 / 日内瓦</strong></p>
</div><p><strong>EIB and STMicroelectronics announce €1 billion agreement to boost Europe’s competitiveness and strategic autonomy</strong></p>
<div class="lb-trans"><p><strong>欧洲投资银行与意法半导体宣布达成 10 亿欧元协议，以提升欧洲的竞争力和战略自主性</strong></p>
</div><ul>
<li><strong>Credit line to strengthen Europe’s semiconductor industry and support innovation, sustainability and energy efficiency in line with EU objectives</strong></li>
<li><strong>First €500 million tranche signed to support acceleration of R&amp;D and high-volume chip manufacturing in Italy and France.</strong></li>
<li><strong>The new agreement, the ninth between EIB and ST, brings total financing to around €4.2 billion</strong></li>
</ul>
<div class="lb-trans"><ul>
<li><strong>信贷额度旨在加强欧洲半导体产业，并支持符合欧盟目标的创新、可持续性和能源效率</strong></li>
<li><strong>首个 5 亿欧元的分期贷款已签署，以支持意大利和法国的研发加速及大规模芯片制造。</strong></li>
<li><strong>这项新协议是欧洲投资银行与意法半导体之间的第九项协议，使总融资额达到约 42 亿欧元</strong></li>
</ul>
</div><p>The European Investment Bank (EIB) and STMicroelectronics (NYSE:STM, “ST”) have signed a €500 million financing agreement to boost Europe’s competitiveness and strategic autonomy. This represents the first tranche a broader €1 billion credit line recently approved by the EIB in favour of STMicroelectronics, a leading semiconductor manufacturer with a strong footprint in Europe including Italy, France and Malta and serving the automotive, industrial, personal electronics, and communication infrastructure markets.</p>
<div class="lb-trans"><p>欧洲投资银行（EIB）与意法半导体（NYSE:STM，简称 “ST”）签署了一项 5 亿欧元的融资协议，以提升欧洲的竞争力和战略自主性。这是 EIB 最近批准的针对意法半导体的更大规模 10 亿欧元信贷额度的首个分期贷款。意法半导体是一家在欧洲（包括意大利、法国和马耳他）具有强大影响力的领先半导体制造商，服务于汽车、工业、个人电子和通信基础设施市场。</p>
</div><p>Since 1994, the Bank has supported nine projects with ST, resulting in approximately €4.2 billion of financing. This new operation will help support ST’s investment programme in innovative semiconductor technologies and devices in Italy and France, where the company operates both research and development and high-volume manufacturing. About 60% of the agreement is focused on high-volume manufacturing capabilities, including the key sites of Catania, Agrate and Crolles, while the remaining 40% is focused on R&amp;D.</p>
<div class="lb-trans"><p>自 1994 年以来，EIB 已支持与 ST 的九个项目，融资总额约为 42 亿欧元。这项新业务将支持 ST 在意大利和法国的创新半导体技术和设备投资计划，ST 在这两个国家同时开展研发和大规模制造。协议中约 60% 的资金将用于大规模制造能力，包括卡塔尼亚、阿格拉泰和克罗莱斯等关键地点，其余 40% 则专注于研发。</p>
</div><p>“Europe’s ability to lead in semiconductor innovation is vital for our competitiveness, resilience and climate goals. This agreement reflects the EIB’s commitment to supporting strategic industries that enable the green and digital transitions and strengthen Europe’s technological sovereignty,” said <strong>Gelsomina Vigliotti, EIB Vice-President.</strong></p>
<div class="lb-trans"><p>“欧洲在半导体创新方面的领导能力对我们的竞争力、韧性和气候目标至关重要。这项协议反映了 EIB 对支持战略产业的承诺，这些产业能够促进绿色和数字转型，并增强欧洲的技术主权，”<strong>EIB 副行长 Gelsomina Vigliotti</strong> 表示。</p>
</div><p>“ST continues to be committed to strengthening Europe’s semiconductor ecosystem, and this significant loan from EIB aims at bolstering our efforts in R&amp;D for differentiated technologies and high-volume manufacturing across our sites in Italy and France”, said <strong>Jean-Marc Chery, President and CEO of STMicroelectronics</strong>. “ST’s longstanding collaboration with the EIB underscores our commitment to ensuring European technology leadership in the global semiconductor market.”</p>
<div class="lb-trans"><p>“ST 继续致力于加强欧洲的半导体生态系统，而 EIB 的这笔重要贷款旨在增强我们在意大利和法国各个地点的研发和大规模制造的努力，”<strong>意法半导体总裁兼首席执行官 Jean-Marc Chery</strong> 表示。“ST 与 EIB 的长期合作强调了我们确保欧洲在全球半导体市场中技术领导地位的承诺。”</p>
</div><p>“Semiconductors are at the heart of modern economies, powering everything from electric vehicles to digital infrastructure. By financing ST’s investments in research and advanced manufacturing, we are helping Europe secure critical technologies and create high-skilled jobs for the future,” added <strong>EIB Vice-President Ambroise Fayolle</strong>.</p>
<div class="lb-trans"><p>“半导体是现代经济的核心，驱动着从电动车到数字基础设施的一切。通过为 ST 在研究和先进制造方面的投资提供融资，我们正在帮助欧洲确保关键技术，并为未来创造高技能就业机会，”<strong>EIB 副行长 Ambroise Fayolle</strong> 补充道。</p>
</div><p>The agreement announced today follows last week’s visit by a high-level EIB delegation, led by Vice-Presidents Gelsomina Vigliotti and Ambroise Fayolle, to ST’s facility in Catania, a state-of-the-art plant covering the full Silicon Carbide (SiC) value chain and representing a key element of the EU Bank’s financing.</p>
<div class="lb-trans"><p>今天宣布的协议是在上周 EIB 高层代表团访问 ST 位于卡塔尼亚的设施后达成的，该设施是一个涵盖整个碳化硅（SiC）价值链的先进工厂，是欧盟银行融资的关键组成部分。</p>
</div><p><strong>General information</strong></p>
<div class="lb-trans"><p><strong>一般信息</strong></p>
</div><p>The European Investment Bank (ElB) is the long-term lending institution of the European Union, owned by its Member States. Built around eight core priorities, we finance investments that contribute to EU policy objectives by bolstering climate action and the environment, digitalisation and technological innovation, security and defence, cohesion, agriculture and bioeconomy, social infrastructure, the capital markets union, and a stronger Europe in a more peaceful and prosperous world.</p>
<div class="lb-trans"><p>欧洲投资银行（EIB）是欧盟的长期贷款机构，由其成员国拥有。我们围绕八个核心优先事项进行建设，融资那些通过加强气候行动和环境、数字化和技术创新、安全和防御、凝聚力、农业和生物经济、社会基础设施、资本市场联盟以及在一个更加和平和繁荣的世界中增强欧洲实力的投资。</p>
</div><p>The EIB Group, which also includes the European Investment Fund (EIF), signed nearly €89 billion in new financing for over 900 high-impact projects in 2024, boosting Europe’s competitiveness and security. All projects financed by the EIB Group are in line with the Paris Climate Agreement, as pledged in our Climate Bank Roadmap. Almost 60% of the EIB Group’s annual financing supports projects directly contributing to climate change mitigation, adaptation, and a healthier environment.</p>
<div class="lb-trans"><p>EIB 集团还包括欧洲投资基金（EIF），在 2024 年签署了近 890 亿欧元的新融资，用于 900 多个高影响力项目，提升欧洲的竞争力和安全性。EIB 集团资助的所有项目均符合《巴黎气候协定》，正如我们在气候银行路线图中所承诺的那样。EIB 集团近 60% 的年度融资支持直接有助于气候变化缓解、适应和更健康环境的项目。</p>
</div><p>Fostering market integration and mobilising investment, the Group supported a record of over €100 billion in new investment for Europe’s energy security in 2024 and mobilised €110 billion in growth capital for startups, scale-ups and European pioneers. Approximately half of the EIB's financing within the European Union is directed towards cohesion regions, where per capita income is lower than the EU average.</p>
<div class="lb-trans"><p>通过促进市场整合和动员投资，EIB 集团在 2024 年支持了超过 1000 亿欧元的新投资，以增强欧洲的能源安全，并为初创企业、成长型企业和欧洲先锋企业动员了 1100 亿欧元的增长资本。EIB 在欧盟内的融资约一半用于凝聚力地区，这些地区的人均收入低于欧盟平均水平。</p>
</div><p>High-quality, up-to-date photos of our headquarters for media use are available here.</p>
<div class="lb-trans"><p>我们总部的高质量、最新照片可供媒体使用，详见此处。</p>
</div><p><strong>About STMicroelectronics</strong></p>
<div class="lb-trans"><p><strong>关于意法半导体</strong></p>
</div><p>At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our</p>
<div class="lb-trans"><p>在意法半导体，我们是 50,000 名半导体技术的创造者和制造者，掌握着半导体供应链，拥有先进的制造设施。作为一家综合设备制造商，我们与超过 200,000 名客户和数千个合作伙伴合作，设计和构建产品、解决方案和生态系统，以应对他们的挑战和机遇，并支持一个更可持续的世界。我们的技术使更智能的出行、更高效的电力和能源管理以及云连接的自主设备的大规模部署成为可能。我们正朝着在所有直接和间接排放（范围 1 和 2）、产品运输、商务旅行和员工通勤排放（我们的范围 3 重点）中实现碳中和的目标迈进，并实现我们的</p>
</div><p>100%</p>
<div class="lb-trans"><p>100%</p>
</div><p>renewable electricity sourcing goal by the end of 2027.</p>
<div class="lb-trans"><p>可再生电力采购目标，预计到 2027 年底实现。</p>
</div><p><strong>CONTACTS</strong></p>
<div class="lb-trans"><p><strong>联系方式</strong></p>
</div><p><strong>EIB</strong></p>
<div class="lb-trans"><p><strong>EIB</strong></p>
</div><p>EIB: Lorenzo Squintani</p>
<div class="lb-trans"><p>EIB：Lorenzo Squintani</p>
</div><p>l.squintani@eib.org/press@eib.org</p>
<div class="lb-trans"><p>l.squintani@eib.org/press@eib.org</p>
</div><p>Tel: +39 366 57 90 312</p>
<div class="lb-trans"><p>电话：+39 366 57 90 312</p>
</div><p>Website: www.eib.org/press</p>
<div class="lb-trans"><p>网站：www.eib.org/press</p>
</div><p><strong>ST</strong></p>
<div class="lb-trans"><p><strong>ST</strong></p>
</div><p><em>Investor relations</em></p>
<div class="lb-trans"><p><em>投资者关系</em></p>
</div><p>Jérôme Ramel</p>
<div class="lb-trans"><p>Jérôme Ramel</p>
</div><p>EVP Corporate Development &amp; Integrated External Communication</p>
<div class="lb-trans"><p>企业发展与综合外部沟通执行副总裁</p>
</div><p>Tel: +41.22.929.59.20</p>
<div class="lb-trans"><p>电话：+41.22.929.59.20</p>
</div><p>jerome.ramel@st.com</p>
<div class="lb-trans"><p>jerome.ramel@st.com</p>
</div><p><em>Media relations</em></p>
<div class="lb-trans"><p><em>媒体关系</em></p>
</div><p>Alexis Breton</p>
<div class="lb-trans"><p>Alexis Breton</p>
</div><p>Group VP Corporate External Communications</p>
<div class="lb-trans"><p>集团副总裁企业外部沟通</p>
</div><p>Tel: +33.6.59.16.79.08</p>
<div class="lb-trans"><p>电话：+33.6.59.16.79.08</p>
</div><p>alexis.breton@st.com</p>
<div class="lb-trans"><p>alexis.breton@st.com</p>
</div><ul>
<li>C3376C - 251211_EN_PR_EIB-STMicroelectronics_FINAL FOR PUBLICATION</li>
</ul>
<div class="lb-trans"><ul>
<li>C3376C - 251211_EN_PR_EIB-STMicroelectronics_FINAL FOR PUBLICATION</li>
</ul>
</div><p><img src="https://imageproxy.pbkrs.com/https://www.globenewswire.com/newsroom/ti/query-bmY9TVRBd01URTBOREkxTkNNME1ESXlPREUxTURnak1qQXdNRGN3TlE9PQ" alt="" original-src="https://www.globenewswire.com/newsroom/ti?nf=MTAwMTE0NDI1NCM0MDIyODE1MDgjMjAwMDcwNQ=="/></p>
<p><img src="https://imageproxy.pbkrs.com/https://ml-eu.globenewswire.com/media/MGI1N2I5ZmQtNjhlYy00NmJjLTg2NjctYmRmZmY1YjBmY2JlLTEwMTIyNzgtMjAyNS0xMi0xMS1lbg==/tiny/STMicroelectronics-Internation.png" alt="" original-src="https://ml-eu.globenewswire.com/media/MGI1N2I5ZmQtNjhlYy00NmJjLTg2NjctYmRmZmY1YjBmY2JlLTEwMTIyNzgtMjAyNS0xMi0xMS1lbg==/tiny/STMicroelectronics-Internation.png"/></p>

欧洲投资银行（EIB）和意法半导体（STMicroelectronics）宣布达成一项 10 亿欧元的协议，旨在提升欧洲的竞争力和战略自主性 | STM 股票新闻