--- title: "富国盘点半导体要闻：苹果 (AAPL.US) C1X 实现 “代际飞跃”，英伟达 (NVDA.US) 新机架定价最高 880 万美元" type: "News" locale: "zh-CN" url: "https://longbridge.com/zh-CN/news/280425129.md" description: "富国银行近期关注半导体和信息技术硬件的重要新闻，包括苹果公司（AAPL.US）C1X 调制解调器的出色表现，显示出代际飞跃。分析师指出，美国数据中心建设支出同比增长 31%，SK 海力士提前搬入 DRAM 晶圆厂设备，并计划向阿斯麦采购价值 80 亿美元的 EUV 设备。此外，韩国科学技术院开发的新技术旨在解决 3D NAND 带宽限制问题。" datetime: "2026-03-25T06:57:02.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/280425129.md) - [en](https://longbridge.com/en/news/280425129.md) - [zh-HK](https://longbridge.com/zh-HK/news/280425129.md) --- > 支持的语言: [English](https://longbridge.com/en/news/280425129.md) | [繁體中文](https://longbridge.com/zh-HK/news/280425129.md) # 富国盘点半导体要闻：苹果 (AAPL.US) C1X 实现 “代际飞跃”，英伟达 (NVDA.US) 新机架定价最高 880 万美元 According to the Zhitong Finance APP, Wells Fargo recently highlighted important news reports regarding semiconductors and information technology hardware, including the outstanding performance of Apple's (AAPL.US) C1X modem, which has continued since last week. The team led by analyst Aaron Rakers pointed out that the January construction data released by the U.S. Census Bureau on Monday showed that, seasonally adjusted, U.S. data center construction spending reached $47 billion, a year-on-year increase of 31%. The rolling three-month data center construction spending totaled $138.2 billion, a year-on-year increase of 30%, accelerating from the 27% growth in December last year. Analysts stated that SK Hynix is reportedly advancing the cleanroom equipment move-in schedule for the second phase of its Cheongju M15X DRAM wafer fab by about two months, ahead of the original plan. Additionally, SK Hynix has also moved up the activation date for the cleanroom at its Yongin wafer fab from May 2027 to February 2027. Analysts also specifically mentioned that SK Hynix plans to purchase €6.9 billion (approximately $8 billion) worth of extreme ultraviolet (EUV) lithography equipment from ASML (ASML.US) over a two-year period ending in December 2027. According to TrendForce, the Korea Advanced Institute of Science and Technology (KAIST) has developed a new technology aimed at addressing the bandwidth limitations of 3D NAND. Analysts added that this new technology, referred to as the "smart gate" concept in the semiconductor field, can simultaneously enhance data processing speed and data storage stability. Furthermore, Rakers and his team highlighted recent third-party test results from Ookla, which showed strong performance of the Apple C1X modem. Analysts noted, "The data for the fourth quarter of 2025 clearly shows that Apple's self-developed C1X modem has achieved a generational leap compared to the previous C1 model." The report indicated that the C1X has reached performance levels in download speed and latency comparable to Qualcomm's X80. Analysts stated that they remain focused on the upcoming performance data for Qualcomm's X85 modem (set to be released in early 2025), expecting Android models equipped with this chip to launch in the first half of 2026, while Samsung's recently launched S26 model is also worth noting. Analysts cited relevant reports providing current pricing estimates for NVIDIA's (NVDA.US) Vera-Rubin Ultra NVL144 rack-level product, ranging from $7 million to $8.8 million, in contrast to Grace-Blackwell's pricing of $2.8 million to $3.4 million. Analysts added that Vera-Rubin Ultra chips are expected to start shipping in the second half of 2027. Rakers and his team also noted related reports predicting that personal computer (PC) prices will rise by 25% to 30% in the second quarter of 2026, with the price increase trend expected to continue into the third quarter of 2026. 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