--- title: "瑞萨电子的抗辐射集成电路在 NASA 的阿尔忒弥斯 II 载人月球任务中启航" type: "News" locale: "zh-CN" url: "https://longbridge.com/zh-CN/news/281434458.md" description: "瑞萨电子宣布，其辐射硬化集成电路（IC）正在被用于 NASA 的阿尔忒弥斯 II 号任务，该任务于 4 月 1 日发射。这次任务标志着数十年来首次载人绕月飞行，旨在测试航天器系统和机组人员的表现。瑞萨的辐射硬化 IC 嵌入在猎户座航天器的航空电子和安全系统中，确保在极端条件下的可靠运行。该公司强调其致力于通过专业的半导体解决方案支持未来的太空任务，这些解决方案在航天行业有着悠久的历史" datetime: "2026-04-01T23:03:00.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/281434458.md) - [en](https://longbridge.com/en/news/281434458.md) - [zh-HK](https://longbridge.com/zh-HK/news/281434458.md) --- # 瑞萨电子的抗辐射集成电路在 NASA 的阿尔忒弥斯 II 载人月球任务中启航 TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation ( RNECF ) , a premier supplier of advanced semiconductor solutions, today announced its radiation-hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to return humans to the moon and establish a long-term presence on the lunar surface. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260331236884/en/ Four astronauts are now en route to orbit the moon aboard NASA’s Orion spacecraft as part of NASA’s Artemis II mission, taking humans farther from Earth than they have traveled in over fifty years. During the flight, the crew will test spacecraft systems and crew performance in this deep-space environment before returning safely home. The mission will validate key spacecraft capabilities and position Orion for future crewed journeys and lunar landings. Within the Artemis II core systems, including the Orion capsule and Space Launch System (SLS) rocket, Renesas rad-hard ICs are used across multiple subsystems. These Intersil-branded devices are embedded in the space vehicle’s avionics and safety launch system, helping to regulate and distribute power, maintain signal integrity and support onboard computing. These specialized ICs are built to operate reliably when exposed to the elevated levels of radiation and extreme temperatures that are typical of human space missions. “Human space flight missions leave no margin for failure, and we’re proud to be one of the select few semiconductor companies entrusted to provide space-qualified technology for this historic crewed Artemis mission,” said **Chris Stephens, Vice President of the HiRel Business Division at Renesas**. “Our rad-hard devices help keep spacecraft systems connected, protected and precisely controlled, as crews venture into deep space. We look forward to supporting future landmark missions and ushering in the next era of solar system exploration with our space-grade semiconductor solutions.” The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally-optimized and highly-reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C). For more information on Renesas’ Intersil-brand space and hi-reliability solutions, visit: www.renesas.com/space. **About Renesas Electronics Corporation ( RNECF )** Renesas Electronics Corporation ( RNECF ) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. View source version on businesswire.com: https://www.businesswire.com/news/home/20260331236884/en/ Source: Renesas Electronics Corporation ( RNECF ) ### 相关股票 - [6723.JP](https://longbridge.com/zh-CN/quote/6723.JP.md) ## 相关资讯与研究 - [NASA 发布火星互联网招标书： 一场价值 7 亿美元的星际竞标](https://longbridge.com/zh-CN/news/286676424.md) - [尴尬！小红书砸 1.48 亿买了个啥？](https://longbridge.com/zh-CN/news/286725746.md) - [新股消息 | 博瑞医药递表港交所 BGM0504 具全球同类最佳潜力](https://longbridge.com/zh-CN/news/286778872.md) - [瑞众保险护航 2026“蒙超” 呼和浩特队，以 “保险 + 体育” 新范式守护城市荣耀！](https://longbridge.com/zh-CN/news/286880685.md) - [雷声公司完成 Landsat Next 下一代太空仪器关键设计评审](https://longbridge.com/zh-CN/news/286796519.md)