--- title: "台积电称，随着人工智能推动市场增长，全球芯片市场预计到 2030 年将达到 1.5 万亿美元" type: "News" locale: "zh-CN" url: "https://longbridge.com/zh-CN/news/286345902.md" description: "台积电预测到 2030 年，全球半导体市场将超过 1.5 万亿美元，主要受到人工智能和高性能计算的推动，这两者将占市场的 55%。该公司计划大幅扩展其产能，预计 2026 年至 2028 年其先进芯片的年复合增长率将达到 70%，而其先进封装技术的年复合增长率将超过 80%。台积电还在亚利桑那州、日本和德国扩展其全球布局，以满足日益增长的需求，特别是对人工智能芯片的需求" datetime: "2026-05-14T02:06:00.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/286345902.md) - [en](https://longbridge.com/en/news/286345902.md) - [zh-HK](https://longbridge.com/zh-HK/news/286345902.md) --- # 台积电称，随着人工智能推动市场增长，全球芯片市场预计到 2030 年将达到 1.5 万亿美元 HSINCHU, Taiwan, May 14 (Reuters) - TSMC, the world's largest contract chipmaker, expects the global semiconductor market to exceed $1.5 trillion by 2030, topping its previous forecast of $1 trillion, according to its presentation materials ahead of a tech symposium on Thursday. Here are the ​details: \-- AI and high-performance computing are expected to account for 55% of the $1.5 trillion market, followed by smartphones with 20%, and automotive applications with 10%, according to TSMC. \-- TSMC said it has been expanding capacity at a faster pace in 2025 and 2026 and plans to build nine phases of wafer fabs and advanced packaging facilities in 2026. \-- The chipmaker is projected to ramp up capacity for its most advanced 2-nanometer and next generation A16 chips, with a compounded annual growth rate (CAGR) of 70% from 2026 to 2028. \-- TSMC said CAGR of capacity for its advanced packaging CoWoS (Chip on Wafer on Substrate) is forecast at more than 80% from 2022 to 2027. CoWoS is a key chip packaging technology widely used in AI chips including those designed by Nvidia. \-- The company said AI accelerator wafer demand is projected to increase 11-fold from 2022 to 2026. TSMC'S GLOBAL FOOTPRINT \-- Arizona: The first fab is already in production. Tool move-in for the second fab is planned for the second half of 2026. Construction of a third fab is underway. Work on a fourth fab and the site's first advanced packaging facility is expected to begin this year. \-- TSMC anticipates a 1.8-fold year-on-year increase in Arizona output by 2026, with yields comparable to those in Taiwan. \-- The chipmaker said it completed the purchase of a second large parcel of land in Arizona for future expansion. \-- Japan: The first fab is currently in volume production for 22-nanometer and 28-nanometer products. Plans for the second fab have been upgraded to 3-nanometer in response to strong demand. \-- Germany: The fab is currently under construction and progressing as scheduled. It plans to provide 28-nanometer and 22-nanometer technologies, followed by 16-nanometer and 12-nanometer technologies. (Reporting by Wen-Yee Lee; Editing by Kate Mayberry) ### 相关股票 - [SOXL.US](https://longbridge.com/zh-CN/quote/SOXL.US.md) - [SOXX.US](https://longbridge.com/zh-CN/quote/SOXX.US.md) - [SMH.US](https://longbridge.com/zh-CN/quote/SMH.US.md) - [TSMG.US](https://longbridge.com/zh-CN/quote/TSMG.US.md) - [XSD.US](https://longbridge.com/zh-CN/quote/XSD.US.md) - [TSMU.US](https://longbridge.com/zh-CN/quote/TSMU.US.md) - [PSI.US](https://longbridge.com/zh-CN/quote/PSI.US.md) - [TSMX.US](https://longbridge.com/zh-CN/quote/TSMX.US.md) - [TSM.US](https://longbridge.com/zh-CN/quote/TSM.US.md) - [NVDA.US](https://longbridge.com/zh-CN/quote/NVDA.US.md) - [NVD.DE](https://longbridge.com/zh-CN/quote/NVD.DE.md) ## 相关资讯与研究 - [芯片公司 Analog Devices 据悉接近以 15 亿美元收购 Empower](https://longbridge.com/zh-CN/news/286844066.md) - [AI 芯片初创公司 Tenstorrent 成 “香饽饽”！传英特尔、高通有意收购 估值或超 50 亿美元](https://longbridge.com/zh-CN/news/286828948.md) - [传 Arm 因芯片授权行为遭美国反垄断调查 股价应声大跌](https://longbridge.com/zh-CN/news/286727525.md) - [英伟达财报前夜，黄仁勋、戴尔访谈：AI 正大规模进入企业，最核心瓶颈依旧是存储和先进制程芯片](https://longbridge.com/zh-CN/news/286838346.md) - [杰富瑞泼冷水：Mobileye 短期增长受限，罕见开 “跑输大盘” 评级](https://longbridge.com/zh-CN/news/286811963.md)