---
title: "Micron and TSMC collaborate to produce HBM 4"
type: "News"
locale: "zh-HK"
url: "https://longbridge.com/zh-HK/news/202424260.md"
description: "Micron Technology and TSMC collaborate to produce HBM4 chips, with the goal of mass production starting in 2026. SK Hynix is a leader in the HBM field and partners with NVIDIA to supply AI chips. The collaboration will enhance the competitiveness of custom memory platforms and strengthen SK Hynix's market-leading position as a comprehensive AI memory supplier. TSMC's advanced packaging technology helps HBM chips and Graphics Processing Units (GPUs) work efficiently together. SK Hynix is expected to supply NVIDIA with more advanced HBM3e chips this year"
datetime: "2024-04-21T03:03:41.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/202424260.md)
  - [en](https://longbridge.com/en/news/202424260.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/202424260.md)
---

> 支持的語言: [简体中文](https://longbridge.com/zh-CN/news/202424260.md) | [English](https://longbridge.com/en/news/202424260.md)


# Micron and TSMC collaborate to produce HBM 4

**The world's second-largest memory chip manufacturer, SK Hynix, announced on Friday that it has signed a memorandum of understanding with the world's largest contract chipmaker, TSMC, to collaborate on producing the next generation of high-bandwidth memory (HBM) chips.**

SK Hynix and TSMC are major suppliers to NVIDIA, the leader in the AI chip market. Currently, global chip manufacturers are racing to capitalize on the artificial intelligence boom, driving demand for logic semiconductors such as processors and memory chips.

HBM is crucial for the generative AI field, as it is a key component for generative AI. High-end stacks allow for fast data transfer between processors and memory, unleashing greater computing power.

Currently, only SK Hynix, Samsung Electronics, and Micron are able to provide HBM chips, which can be paired with powerful GPUs like NVIDIA's H100 system for AI computing.

SK Hynix leads in the HBM field, with Trendforce estimating that SK Hynix may capture 52.5% of the global market share this year, followed by Samsung (42.4%) and Micron (5.1%). TSMC's advanced packaging technology will help HBM chips and graphics processing units (GPUs) work efficiently together.

Justin Kim, President and Head of AI Infra at SK Hynix, stated:

> We look forward to establishing a strong partnership with TSMC to accelerate our open collaboration with customers and develop the industry's best-performing HBM4.
> 
> Through this collaboration, we aim to enhance our competitiveness in the custom memory platform space and further strengthen our position as a leading overall AI memory supplier in the market.

Through the collaboration with TSMC, **SK Hynix aims to begin mass production of HBM4 chips in 2026.** The South Korean company currently supplies its HBM3 chips to NVIDIA and expects to ship more advanced HBM3e chips to the company this year

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