---
title: "隨着科技競爭加劇，華為推出 AI 芯片管道"
description: "華為計劃推出新一代人工智能芯片——Ascend 950，以在中國與英偉達競爭。該公司計劃在 2024 年初發布首款芯片，隨後在 2024 年底推出另一款，並計劃在 2027 年和 2028 年進行進一步升級。華為旨在滿足中國日益增長的計算能力需求，尤其是在美國對半導體技術的限制給當地人工智能開發者帶來挑戰的背景下。這些新芯片將採用先進的捆綁技術來增強計算能力，使華為在與英偉達的持續科技競爭中成為關"
type: "news"
locale: "zh-HK"
url: "https://longbridge.com/zh-HK/news/257875159.md"
published_at: "2025-09-18T09:20:29.000Z"
---

# 隨着科技競爭加劇，華為推出 AI 芯片管道

> 華為計劃推出新一代人工智能芯片——Ascend 950，以在中國與英偉達競爭。該公司計劃在 2024 年初發布首款芯片，隨後在 2024 年底推出另一款，並計劃在 2027 年和 2028 年進行進一步升級。華為旨在滿足中國日益增長的計算能力需求，尤其是在美國對半導體技術的限制給當地人工智能開發者帶來挑戰的背景下。這些新芯片將採用先進的捆綁技術來增強計算能力，使華為在與英偉達的持續科技競爭中成為關鍵參與者

By Raffaele Huang and Sherry Qin

Huawei Technologies plans to roll out more artificial-intelligence chips in the next three years, giving a rare glimpse into its ambitions to compete with Nvidia in China.

The first will be a new generation of its Ascend chips, seen as a potential challenger to Nvidia's offerings in the country. As the U.S. tech giant faces more difficulty in doing business in China, local companies are vying to step in to fill the void.

Huawei announced its chip pipeline on Thursday, which includes two variants of the new lineup, called Ascend 950, that handle different AI workloads. The chips will use high-bandwidth memory units that Huawei develops, and support a computing format that is increasingly popular among Chinese AI developers.

"Computing power is, and will continue to be, key to AI. This is especially true in China," Huawei Deputy Chairman Eric Xu said at an event in Shanghai.

Huawei plans to release the first of the new chips in the first three months of next year, followed by another in the fourth quarter. It aims to roll out two upgraded lineups in 2027 and 2028.

"We will follow a one-year release cycle and double compute with each release," Xu said. He said Huawei is using the chip-making technology that is "practically available" to China to address the country's surging demand for computing.

The Chinese company also launched technology that can bundle thousands of chips, an advance it said could help address a bottleneck in large-scale AI computing infrastructure.

Washington has blacklisted Huawei since 2019, forcing the Chinese tech juggernaut to bet on its own alternatives. It has since become a key player in Beijing's national push for self-sufficiency, participating in projects to build a domestic semiconductor supply chain.

That has pitted Huawei against Nvidia as proxies in the escalating technology battle between Beijing and Washington. Since 2022, the U.S. government has restricted China's access to advanced semiconductor technologies. That has caused headaches for AI developers in China, but also prompted them to find workarounds.

Huawei's current Ascend AI chips still lag behind Nvidia's best products but the Chinese company has been investing in developing networking technology--an area it excelled in as a telecommunications equipment maker--to bundle more chips together to boost computing capabilities.

Huawei's latest supernode products, Atlas 950 and Atlas 960, can link 8,192 and 15,488 Ascend chips, respectively, it said. The chip-bundling technology can be used to build big groups of computers, known as clusters, containing up to a million of Huawei's AI chips and working together as a single system, the company said.

Building these types of clusters is key to training large-scale AI models. Nvidia's technology for connecting individual chips and facilitating data transfer has been a secret sauce that keeps global engineers--including those in China--addicted.

According to Xu, the new Huawei system built with the Atlas 950 supernode, which will be available in late 2026, will surpass a system that Nvidia plans to release in 2027.

Nvidia didn't immediately respond to a request for comment.

Write to Raffaele Huang at raffaele.huang@wsj.com and Sherry Qin at sherry.qin@wsj.com

(END) Dow Jones Newswires

September 18, 2025 05:04 ET (09:04 GMT)

Copyright (c) 2025 Dow Jones & Company, Inc.

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