---
title: "台積電的新廠 Fab 25 預計將在 2028 年開始生產 A14 芯片"
description: "台積電已提交其位於台中的新 Fab 25 設施的建設許可證，計劃在 2028 年下半年生產下一代 A14 芯片。A14 工藝將採用台積電的 NanoFlex Pro 架構，提供顯著的性能和效率提升。該項目涉及約 490 億美元的投資，預計在完成後將創造約 4500 個就業機會"
type: "news"
locale: "zh-HK"
url: "https://longbridge.com/zh-HK/news/261808056.md"
published_at: "2025-10-20T03:58:45.000Z"
---

# 台積電的新廠 Fab 25 預計將在 2028 年開始生產 A14 芯片

> 台積電已提交其位於台中的新 Fab 25 設施的建設許可證，計劃在 2028 年下半年生產下一代 A14 芯片。A14 工藝將採用台積電的 NanoFlex Pro 架構，提供顯著的性能和效率提升。該項目涉及約 490 億美元的投資，預計在完成後將創造約 4500 個就業機會

根據官方文件和媒體報道，台積電已向當地科技園區管理局提交了其新建 Fab 25 設施的建設許可證。該晶圓廠將作為公司下一代 A14 工藝的關鍵生產基地，計劃於 2028 年下半年實現量產。

A14 工藝採用了台積電的 NanoFlex Pro 標準單元架構，相比 N2 工藝在全節點性能和效率上有顯著提升——在相同功耗下速度提高了 15%，或在相同速度下功耗降低了 30%，邏輯密度提高超過 20%。該項目總投資約為 490 億美元，預計在全面運營後將創造約 4500 個就業崗位。

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