--- title: "Guangdong Tianyu Semiconductor Enters Strategic Cooperation with Qinghe Jingyuan" type: "News" locale: "zh-HK" url: "https://longbridge.com/zh-HK/news/272840836.md" datetime: "2026-01-16T13:14:30.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/272840836.md) - [en](https://longbridge.com/en/news/272840836.md) - [zh-HK](https://longbridge.com/zh-HK/news/272840836.md) --- > 支持的語言: [简体中文](https://longbridge.com/zh-CN/news/272840836.md) | [English](https://longbridge.com/en/news/272840836.md) # Guangdong Tianyu Semiconductor Enters Strategic Cooperation with Qinghe Jingyuan Guangdong Tianyu Semiconductor Co., Ltd. has announced that it has entered into a strategic cooperation agreement with Qinghe Jingyuan Semiconductor Technology (Group) Co., Ltd. The partnership, effective from January 16, 2026 to January 15, 2029, will focus on the joint development and technological advancement of bonding materials, including bonded silicon carbide (SiC), silicon on insulator (SOI), and piezoelectric on insulator (POI). The collaboration aims to leverage both companies’ expertise in semiconductor bonding integration technology, benefiting the future development of Guangdong Tianyu Semiconductor and its stakeholders. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Guangdong Tianyu Semiconductor Co. Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260116-11994003), on January 16, 2026, and is solely responsible for the information contained therein. © Copyright 2026 - Public Technologies (PUBT) ### 相關股票 - [Direxion Semicon Bull 3X (SOXL.US)](https://longbridge.com/zh-HK/quote/SOXL.US.md) ## 相關資訊與研究 - [08:01 ETInnofiber, Acrolite, and PAVE Technology Co. Combine to Form Connexis Group, a Leading Provider of High-Performance Interconnect Solutions](https://longbridge.com/zh-HK/news/281362986.md) - [TSMC Gets Nod to Deploy 3nm Process at Japan Fab](https://longbridge.com/zh-HK/news/281343240.md) - [MIMOS, Global Electronics Association team up to advance Malaysia’s electronics and semiconductor ecosystem](https://longbridge.com/zh-HK/news/281611530.md) - [What's Going On With SEALSQ Stock Wednesday?](https://longbridge.com/zh-HK/news/281403873.md) - [Taiwan Semiconductor Eyes Cutting-Edge 3nm Production In Japan By 2028](https://longbridge.com/zh-HK/news/281341145.md)