--- title: "AI data center power architecture new changes! Infineon: Sidecar will become a transitional product before 2029" type: "News" locale: "zh-HK" url: "https://longbridge.com/zh-HK/news/281293481.md" description: "Infineon announced at the \"AI Power Technology Day\" event that future AI server racks will develop towards high-voltage direct current (HVDC) power distribution. The power side rack (SideCar) expected to be launched in 2026 will be a transitional product, and by 2029, it will shift to a centralized power architecture and solid-state transformers (SST). This architecture will improve space and energy efficiency, with future data centers adopting 800V direct current, and the power systems will be highly centralized to support higher computing performance and computing density" datetime: "2026-04-01T03:10:57.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/281293481.md) - [en](https://longbridge.com/en/news/281293481.md) - [zh-HK](https://longbridge.com/zh-HK/news/281293481.md) --- > 支持的語言: [简体中文](https://longbridge.com/zh-CN/news/281293481.md) | [English](https://longbridge.com/en/news/281293481.md) # AI data center power architecture new changes! Infineon: Sidecar will become a transitional product before 2029 Adam White, President of the Power and Sensor Systems Division at major power semiconductor manufacturer Infineon, pointed out that in the coming years, AI server cabinets will develop towards high-voltage direct current (HVDC) distribution routes. The second-generation power architecture in 2026 will feature a SideCar on the power side, but this is a transitional product. By 2029, it will evolve into a centralized power architecture and solid-state transformer (SST), providing vertical power to GPUs to improve space and energy efficiency. At the "AI Power Technology Day" event held by Infineon on the 31st, Adam White stated that it is expected to seize the megawatt-level AI data center opportunities by expanding global production capacity, upgrading silicon carbide (SiC) wafer sizes, and promoting innovative technologies such as solid-state transformers (SST), forecasting the future power architecture from the grid to processor cores. AI data centers will move towards higher voltage and high power density development. Adam White pointed out that future data center architectures will trend towards 800V DC and centralized power plant configurations. The power side cabinet (Side Car) will be mainstream in 2026, but in the third-generation (Gen 3) power architecture after 2029, CSP and chip manufacturers plan to directly introduce 800V DC from the backplane into server cabinets and motherboards, eliminating the need for transitional power side cabinets. Infineon executives indicated that this is to maximize computing performance and increase computing power density. The uninterruptible power supply (UPS) and centralized backup battery (BBU) power equipment in data centers will be moved out in the future, completely reserving valuable physical space for high-performance computing devices such as GPUs. The power system will be highly centralized, and as the power and cooling demands of a single cabinet rise, the future power architecture will resemble a centralized grid structure like a "power plant," with all distribution links concentrated in one place in the data center, uniformly outputting DC power to each motherboard. Adam pointed out that due to advancements in silicon carbide technology, solid-state transformers (SST) will mainly be used in U.S. data centers. SST can directly handle extremely high-voltage AC power from power plants or the grid, as well as high switching frequencies. At the same time, due to simplified design, it significantly reduces the reliance on metals such as copper in traditional transformers, thereby lowering cost burdens amid recent raw material price increases. Additionally, Infineon also announced the VRM voltage regulation module and vertical power supply technology, the latter of which is currently being validated with customers and is expected to be launched in 2028. By embedding the power module directly into the substrate design, it aims to handle the heat dissipation and power loss brought by high power at an extremely thin thickness. Due to the significant growth in power per cabinet, from 250KW to 1MW per cabinet, Adam also estimated that Infineon's component contribution per cabinet is expected to grow significantly from the first generation's $15,000 (approximately $100 per KW) to over $100,000 (reaching $100-150 per KW) by the time the third-generation power architecture is introduced in 2029 ### 相關股票 - [iShares Semiconductor ETF (SOXX.US)](https://longbridge.com/zh-HK/quote/SOXX.US.md) - [Infineon Technologies AG (IFX.DE)](https://longbridge.com/zh-HK/quote/IFX.DE.md) - [VanEck Semiconductor ETF (SMH.US)](https://longbridge.com/zh-HK/quote/SMH.US.md) - [Direxion Semicon Bull 3X (SOXL.US)](https://longbridge.com/zh-HK/quote/SOXL.US.md) - [SPDR S&P Semicon (XSD.US)](https://longbridge.com/zh-HK/quote/XSD.US.md) - [Infineon Technologies (IFNNY.US)](https://longbridge.com/zh-HK/quote/IFNNY.US.md) ## 相關資訊與研究 - [03:15 ETLunit, CellCarta Announce Strategic Collaboration to Accelerate AI-Enabled Digital Pathology for Companion Diagnostic Programs](https://longbridge.com/zh-HK/news/280971394.md) - [Infineon and DG Matrix partner to drive solid-state transformer technology for AI data centers and industrial power applications](https://longbridge.com/zh-HK/news/280374499.md) - [Truist Initiates Arista Networks With 35% Upside](https://longbridge.com/zh-HK/news/281231540.md) - [Fusemachines Expands Distribution of Its AI Agents Through Global Teams AI Reseller Agreement, Launching with Interview AI Agent | FUSE Stock News](https://longbridge.com/zh-HK/news/281184677.md) - [IC Manage Advances GDP-XL to GDP-AI â Boosting Designer Efficiency and Accelerating Workflows](https://longbridge.com/zh-HK/news/280348649.md)