--- title: "瑞薩電子的抗輻射集成電路在 NASA 的阿爾忒彌斯 II 載人月球任務中啓航" type: "News" locale: "zh-HK" url: "https://longbridge.com/zh-HK/news/281434458.md" description: "瑞薩電子宣佈，其輻射硬化集成電路（IC）正在被用於 NASA 的阿爾忒彌斯 II 號任務，該任務於 4 月 1 日發射。這次任務標誌着數十年來首次載人繞月飛行，旨在測試航天器系統和機組人員的表現。瑞薩的輻射硬化 IC 嵌入在獵户座航天器的航空電子和安全系統中，確保在極端條件下的可靠運行。該公司強調其致力於通過專業的半導體解決方案支持未來的太空任務，這些解決方案在航天行業有着悠久的歷史" datetime: "2026-04-01T23:03:00.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/281434458.md) - [en](https://longbridge.com/en/news/281434458.md) - [zh-HK](https://longbridge.com/zh-HK/news/281434458.md) --- # 瑞薩電子的抗輻射集成電路在 NASA 的阿爾忒彌斯 II 載人月球任務中啓航 TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation ( RNECF ) , a premier supplier of advanced semiconductor solutions, today announced its radiation-hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to return humans to the moon and establish a long-term presence on the lunar surface. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260331236884/en/ Four astronauts are now en route to orbit the moon aboard NASA’s Orion spacecraft as part of NASA’s Artemis II mission, taking humans farther from Earth than they have traveled in over fifty years. During the flight, the crew will test spacecraft systems and crew performance in this deep-space environment before returning safely home. The mission will validate key spacecraft capabilities and position Orion for future crewed journeys and lunar landings. Within the Artemis II core systems, including the Orion capsule and Space Launch System (SLS) rocket, Renesas rad-hard ICs are used across multiple subsystems. These Intersil-branded devices are embedded in the space vehicle’s avionics and safety launch system, helping to regulate and distribute power, maintain signal integrity and support onboard computing. These specialized ICs are built to operate reliably when exposed to the elevated levels of radiation and extreme temperatures that are typical of human space missions. “Human space flight missions leave no margin for failure, and we’re proud to be one of the select few semiconductor companies entrusted to provide space-qualified technology for this historic crewed Artemis mission,” said **Chris Stephens, Vice President of the HiRel Business Division at Renesas**. “Our rad-hard devices help keep spacecraft systems connected, protected and precisely controlled, as crews venture into deep space. We look forward to supporting future landmark missions and ushering in the next era of solar system exploration with our space-grade semiconductor solutions.” The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally-optimized and highly-reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C). For more information on Renesas’ Intersil-brand space and hi-reliability solutions, visit: www.renesas.com/space. **About Renesas Electronics Corporation ( RNECF )** Renesas Electronics Corporation ( RNECF ) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. View source version on businesswire.com: https://www.businesswire.com/news/home/20260331236884/en/ Source: Renesas Electronics Corporation ( RNECF ) ### 相關股票 - [6723.JP](https://longbridge.com/zh-HK/quote/6723.JP.md) ## 相關資訊與研究 - [資料中心需求佳 MCU 廠瑞薩營益暴增 5 成](https://longbridge.com/zh-HK/news/283947238.md) - [NASA 測試新耐輻射晶片：早期性能已高達現役處理器 500 倍](https://longbridge.com/zh-HK/news/286829031.md) - [瑞銀下調瑞士再保險評級至「賣出」，預計 2026 至 2029 年定價週期趨軟](https://longbridge.com/zh-HK/news/287219738.md) - [兆豐票券 50 週年 董瑞斌期許再創高峰](https://longbridge.com/zh-HK/news/287038384.md) - [鉅亨速報 - Factset 最新調查：瑞昱 (2379-TW) EPS 預估上修至 32.55 元，預估目標價為 600 元](https://longbridge.com/zh-HK/news/287062477.md)