--- title: "台積電稱，隨着人工智能推動市場增長，全球芯片市場預計到 2030 年將達到 1.5 萬億美元" type: "News" locale: "zh-HK" url: "https://longbridge.com/zh-HK/news/286345902.md" description: "台積電預測到 2030 年，全球半導體市場將超過 1.5 萬億美元，主要受到人工智能和高性能計算的推動，這兩者將佔市場的 55%。該公司計劃大幅擴展其產能，預計 2026 年至 2028 年其先進芯片的年複合增長率將達到 70%，而其先進封裝技術的年複合增長率將超過 80%。台積電還在亞利桑那州、日本和德國擴展其全球佈局，以滿足日益增長的需求，特別是對人工智能芯片的需求" datetime: "2026-05-14T02:06:00.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/286345902.md) - [en](https://longbridge.com/en/news/286345902.md) - [zh-HK](https://longbridge.com/zh-HK/news/286345902.md) --- # 台積電稱，隨着人工智能推動市場增長，全球芯片市場預計到 2030 年將達到 1.5 萬億美元 HSINCHU, Taiwan, May 14 (Reuters) - TSMC, the world's largest contract chipmaker, expects the global semiconductor market to exceed $1.5 trillion by 2030, topping its previous forecast of $1 trillion, according to its presentation materials ahead of a tech symposium on Thursday. Here are the ​details: \-- AI and high-performance computing are expected to account for 55% of the $1.5 trillion market, followed by smartphones with 20%, and automotive applications with 10%, according to TSMC. \-- TSMC said it has been expanding capacity at a faster pace in 2025 and 2026 and plans to build nine phases of wafer fabs and advanced packaging facilities in 2026. \-- The chipmaker is projected to ramp up capacity for its most advanced 2-nanometer and next generation A16 chips, with a compounded annual growth rate (CAGR) of 70% from 2026 to 2028. \-- TSMC said CAGR of capacity for its advanced packaging CoWoS (Chip on Wafer on Substrate) is forecast at more than 80% from 2022 to 2027. CoWoS is a key chip packaging technology widely used in AI chips including those designed by Nvidia. \-- The company said AI accelerator wafer demand is projected to increase 11-fold from 2022 to 2026. TSMC'S GLOBAL FOOTPRINT \-- Arizona: The first fab is already in production. Tool move-in for the second fab is planned for the second half of 2026. Construction of a third fab is underway. Work on a fourth fab and the site's first advanced packaging facility is expected to begin this year. \-- TSMC anticipates a 1.8-fold year-on-year increase in Arizona output by 2026, with yields comparable to those in Taiwan. \-- The chipmaker said it completed the purchase of a second large parcel of land in Arizona for future expansion. \-- Japan: The first fab is currently in volume production for 22-nanometer and 28-nanometer products. Plans for the second fab have been upgraded to 3-nanometer in response to strong demand. \-- Germany: The fab is currently under construction and progressing as scheduled. It plans to provide 28-nanometer and 22-nanometer technologies, followed by 16-nanometer and 12-nanometer technologies. (Reporting by Wen-Yee Lee; Editing by Kate Mayberry) ### 相關股票 - [SOXL.US](https://longbridge.com/zh-HK/quote/SOXL.US.md) - [SOXX.US](https://longbridge.com/zh-HK/quote/SOXX.US.md) - [SMH.US](https://longbridge.com/zh-HK/quote/SMH.US.md) - [TSMG.US](https://longbridge.com/zh-HK/quote/TSMG.US.md) - [XSD.US](https://longbridge.com/zh-HK/quote/XSD.US.md) - [TSMU.US](https://longbridge.com/zh-HK/quote/TSMU.US.md) - [PSI.US](https://longbridge.com/zh-HK/quote/PSI.US.md) - [TSMX.US](https://longbridge.com/zh-HK/quote/TSMX.US.md) - [TSM.US](https://longbridge.com/zh-HK/quote/TSM.US.md) - [NVDA.US](https://longbridge.com/zh-HK/quote/NVDA.US.md) - [NVD.DE](https://longbridge.com/zh-HK/quote/NVD.DE.md) ## 相關資訊與研究 - [HighTower Advisors LLC 提升了台灣半導體制造公司有限公司 $TSM 的股票頭寸](https://longbridge.com/zh-HK/news/286875739.md) - [台積電副總裁田博仁購入 2,000 股普通股，價值 139,810 美元](https://longbridge.com/zh-HK/news/286895464.md) - [值得關注的內部交易活動：BorZen Tien 投資了 13.9 萬美元購買台灣半導體的股票](https://longbridge.com/zh-HK/news/286936172.md) - [庫克公司押注亞洲人工智能的繁榮，推出了一個規模達 4 億美元的對沖基金](https://longbridge.com/zh-HK/news/286858906.md) - [芯片公司 Analog Devices 據悉接近以 15 億美元收購 Empower](https://longbridge.com/zh-HK/news/286844066.md)