
AI SK plans to more than double its HBM production capacity

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SK Hynix plans to expand its investment in HBE production facilities, with investments in facilities related to Through Silicon Via (TSV) expected to more than double by 2023. The company aims to double its production capacity and plans to start producing its fifth-generation high-bandwidth memory product, HBM3E, in the first half of 2024 to meet the increasing demand for high-performance AI products.
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