Hong Kong Stock Concept Tracking | CoWoS faces severe supply gap in advanced packaging Advanced packaging equipment growth exceeds expectations (with concept stocks)

Taiwan Semiconductor is accelerating the CoWoS expansion, but facing a serious supply shortage. It is expected that the monthly production capacity will increase to 40,000 wafers in the second half of 2024, and will further increase to 58,000 wafers per month in 2025. The annual growth rate of CoWoS capacity will reach 70%, with NVIDIA accounting for nearly half of the demand. In terms of HBM, H100 will be equipped with 80GB of HBM3, while B200 will be equipped with 288GB of HBM3e. The related company ASMPT is the main supplier of Taiwan Semiconductor's CoWoS and HBM products. The CoWoS packaging, as a bottleneck in the industry chain, will continue to benefit from the increasing demand