
Behind the delayed shipment of Blackwell: NVIDIA and Taiwan Semiconductor caught in "internal strife", one side blames packaging technology, the other side claims to be forced to rush work

Media reports that some NVIDIA engineers believe that the issues with the Blackwell chip partly stem from design flaws, while others believe they stem from TSMC adopting new technology for packaging different chips; TSMC employees believe NVIDIA rushed the production process, not leaving enough time to address issues; when shareholders came knocking due to Blackwell shipment delays, TSMC's investor relations department shifted blame to NVIDIA. Although these issues are not enough to affect the nearly thirty-year partnership between the two companies, they highlight that while the AI business is lucrative, NVIDIA's pressure on TSMC is increasing
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