NXP Semiconductors and a subsidiary of Taiwan Semiconductor have broken ground on a joint venture chip factory in Singapore
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NXP Semiconductors and a joint venture supported by Taiwan Semiconductor have broken ground on a $7.8 billion chip factory in Singapore, with initial production expected to begin in 2027. The factory will support the diversification of the global semiconductor supply chain and may expand in the future, with an expected monthly output of 55,000 300mm wafers by 2029, creating 1,500 jobs
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