Advanced Semiconductor Engineering launches CPO energy efficiency solutions targeting AI data center applications
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Advanced Semiconductor Engineering has launched Co-Packaged Optics (CPO) components aimed at reducing power consumption and meeting the application demands of artificial intelligence (AI) data centers. This technology integrates multiple optical engines with ASIC chips within a single package, shortening electrical connection paths, reducing insertion loss, and enhancing data throughput. Advanced Semiconductor Engineering emphasizes that the CPO design can significantly improve system bandwidth density to meet the growing demands of AI, cloud, and edge computing data centers
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