In 2025, Shanghai plans to issue an additional general bond of 23.1 billion yuan
According to the new bond quota issued by the Ministry of Finance to Shanghai, the city plans to issue an additional general bond of 23.1 billion yuan in 2025, of which: 12.7 billion yuan will be used at the municipal level, mainly for municipal basic construction financing and infrastructure construction in the Lingang New Area; 10.4 billion yuan will be used for district-level loans, with each district combining actual conditions to fund infrastructure projects in areas such as municipal roads, sewage treatment, social undertakings, and environmental protection
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