Ming-Chi Kuo: Changxin has become TSMC's advanced packaging materials supplier for the first time
On August 12th, Guo Mingqi, an analyst from Tianfeng International Securities who has been tracking the Apple supply chain for many years, released a research report indicating that Changxing has defeated Japanese companies Namics and Nagase to become TSMC's advanced packaging materials supplier for the first time, with mass production expected in 2026. Changxing will be the exclusive supplier of advanced packaging materials for Apple's new iPhone and Mac processors in 2026, and is expected to become the exclusive or major supplier of TSMC's CoWoS LMC as early as 2027-2028
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