Huida Materials signs a contract with Wuhan Economic and Technological Development Zone to build a research and manufacturing base for wafer thinning grinding wheels
On August 19th, Wuhan Economic Development Zone signed a cooperation agreement with Wuhan Huida Material Technology Co., Ltd., establishing the Huida wafer thinning grinding wheel R&D and manufacturing base in Wuhan Economic Development Comprehensive Bonded Zone. Huida Materials focuses on the R&D and manufacturing of precision diamond tools for semiconductor industry applications. The total investment for the Huida wafer thinning grinding wheel R&D and manufacturing base is 230 million yuan, which will include production lines for 6 to 12-inch wafer thinning grinding wheels
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