Luster: The optoelectronic integrated chip design and packaging solutions introduced by agents are suitable for CPO/OIO small-sized multi-channel packaging
Luster stated on the interactive platform that the optoelectronic integrated chip design and packaging solutions introduced by the company mainly use 3D lithography technology to prepare polymer waveguides of any shape, replacing traditional lens coupling with photonic wire bonding. This solution features high alignment accuracy, reduced optical signal attenuation, and is suitable for industrial mass applications, making it applicable for CPO/OIO small-sized multi-channel packaging
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