Report: Samsung Electronics' 12-layer stacked HBM3E chip products pass NVIDIA testing
According to reports, Samsung Electronics' 12-layer stacked HBM3E chip products have recently passed certification testing by NVIDIA. Samsung received the approval approximately 18 months after completing the chip's development
Source: Wallstreetcn The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
Post your comment
No Comments