GOKE: Plans to develop a full range of in-vehicle AI chips with computing power ranging from low to high, targeting 2 million to 8 million units within three years

GOKE released the record of investor relations activities. The vehicle-mounted AI series chips launched by the company are mainly used in products such as front-mounted intelligent cameras, dash cameras, streaming electronic rearview mirrors, electronic side mirrors, camera monitoring systems, driver fatigue monitoring systems, cabin monitoring systems, and front-view ADAS integrated machines. The new generation of vehicle-mounted AI chips that meet AEC-Q100 Grade 2 is expected to be launched in the first half of 2025, with the chip already returned and lit up. Relevant AEC-Q100 verification is currently underway and is being actively promoted. The company will continue to develop new products, planning to form a full range of vehicle-mounted AI chips with a computing power ranging from low to high, totaling 2 million to 8 million units within three years