Intel's brand new 18A process AI PC chip makes its debut, with full production at its U.S. manufacturing plant

In addition to attracting external investment, Intel, which is striving to overcome difficulties, is also promoting the production of its most advanced process products in the United States. On October 9th, Eastern Time, Intel first revealed details of its first product using the 18A process technology—the next-generation AI PC processor architecture codenamed Panther Lake. This marks a key breakthrough for Intel in manufacturing advanced semiconductor nodes in the United States. The Intel Core Ultra third-generation processors based on the Panther Lake architecture are expected to start shipping by the end of this year, with widespread market supply anticipated in early next year, specifically January 2026. Meanwhile, Intel disclosed that its Fab 52 facility located in Chandler, Arizona, has fully commenced production and is prepared for mass production of 18A process chips later this year. Intel also previewed its first server processor based on the 18A process, the Xeon 6+, which is planned for release in the first half of 2026. The 18A process is Intel's first 2-nanometer node developed and manufactured in the United States, achieving a 15% improvement in performance-to-power ratio and a 30% improvement in chip density compared to previous generations. Since taking office in March this year, Intel CEO Eric Wu has faced immense pressure for company transformation. As of the close of trading on Wednesday this week, Intel's stock price has risen nearly 87% this year, as the company continues to strive to catch up with the cutting-edge chip demand brought about by the artificial intelligence (AI) revolution. On Thursday, Intel is expected to see a slight increase, marking its third consecutive rise and reaching a closing high not seen in a year and a half. Panther Lake Architecture: Multi-Chip Design Enhances AI Performance The Intel Core Ultra third-generation processors adopt a scalable multi-chip architecture, providing unprecedented flexibility for partners across different form factors, market segments, and price points. The processor is equipped with up to 16 performance cores and efficiency cores, with CPU performance improved by over 50% compared to previous generations. The integrated Intel Arc GPU features up to 12 Xe cores, also achieving over a 50% improvement in graphics performance. The chip employs a balanced XPU design, with AI acceleration capabilities reaching 180 Platform TOPS. In addition to PC applications, Panther Lake will also extend to edge applications, including the robotics field. Intel has launched a new robotics AI software suite and reference boards to help customers leverage Panther Lake for developing control and AI perception capabilities. Arizona Factory Commences Production, Strengthening U.S. Manufacturing Fab 52 is Intel's fifth large wafer fabrication facility in the Ocotillo campus in Chandler, Arizona, which has now fully commenced production and is ready for large-scale production using the 18A process. This facility produces the most advanced logic chips within the United States and is a crucial part of Intel's $100 billion expansion investment in the U.S. The 18A process integrates two major innovations: RibbonFET fully wrapped gate transistor technology and PowerVia back power delivery system. RibbonFET is Intel's first new transistor architecture in over a decade, achieving better scaling and more efficient switching performance. PowerVia is a groundbreaking back power delivery system that enhances power flow and signal transmission. Intel stated that the 18A process will serve as the foundation for at least three generations of client and server products in the future. With advanced R&D and manufacturing in Oregon, large-scale manufacturing in Arizona, and packaging operations in New Mexico, Intel provides strategic capacity to support the Trump administration's so-called "America First" agenda and Intel's foundry service customers. Server Chip Layout: Xeon 6+ Aiming at Data Centers The Xeon 6+ processor, codenamed Clearwater Forest, is equipped with up to 288 efficiency cores, achieving a 17% increase in instructions per cycle compared to the previous generation, with significant improvements in density, throughput, and power efficiency. This processor is customized for hyperscale data centers, cloud service providers, and telecommunications operators, helping organizations scale workloads, reduce energy costs, and support smarter services. The Xeon 6+ is planned for release in the first half of 2026 and will be produced at Fab 52 alongside Panther Lake. Intel CEO Eric Wu stated, "We are entering an exciting new era of computing, and the tremendous leap in semiconductor technology will shape the coming decades. The United States has always been home to Intel's most advanced R&D, product design, and manufacturing, and we are proud to continue this tradition as we expand our domestic business and bring new innovations to market."