
Shenzhen Capital Group's Wang Xindong: The Semi Industry Fund focuses on investments in semiconductors and components, chip design, and advanced packaging fields
At the semiconductor investment and financing strategic development forum held today at the 2025 Bay Area Chip Exhibition, Wang Xindong, a member of the Party Committee and Vice President of Shenzhen Innovation Investment Group, stated that the Shenzhen Semiconductor and Integrated Circuit Industry Investment Fund focuses on semiconductor and component investments, chip design, and advanced packaging. Among them, in the semiconductor equipment and components sector, the fund assists leading enterprises in acquiring equipment to maintain their lead, helps high-potential companies with horizontal and vertical integration to become large platforms, focuses on core equipment investments, and addresses gaps to break through advanced processes; in the chip design field, it lays out artificial intelligence chips, emerging computing architectures, and other cutting-edge areas, assisting promising EDA and core IP companies in cultivating international competitiveness; in the advanced packaging sector, it helps leading companies in the packaging field and advanced packaging segment leaders to grow stronger; and it invests in early high-growth teams capable of breaking through overseas advanced packaging patent blockades. According to reports, the fund primarily invests in the startup and growth stages, with a fund duration of 10 years. The fund manager is Futian Hongtu, a wholly-owned subsidiary of Shenzhen Capital Group, and Chong Investment Capital, a wholly-owned subsidiary of Shenzhen Capital Group

