Quectel introduces FME163R Wi-Fi 6 and Bluetooth 5.2 module in M.2 2230 Key-E form for industrial, consumer, and laptop uses.
At Embedded World, North America, Quectel Wireless Solutions announced its latest FME163R module, showcasing Wi-Fi 6 and Bluetooth 5.2 technology. This module boasts a 2 x 2 MIMO connection capability and is based on the Realtek RTL8852 chipset. With compact dimensions of 22.0mm x 30.0mm x 2.85mm, it is designed for easy integration in space-constrained projects. The module features an M.2 2230 Key-E package and offers high power consistency. It presents a cost-effective solution for IoT applications.
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