TrendForce: The Rubin platform's wireless architecture and ASIC high HDI layer architecture drive the PCB industry to become the core of computing power

TrendForce pointed out that the design of AI servers is undergoing a structural transformation. The cable-free architecture of the Rubin platform and the high-level HDI design of self-developed ASIC servers by major cloud providers are driving the PCB industry into the "three high era" of high frequency, high power, and high density. PCBs are no longer just circuit carriers but have become the core layer of computing power. It is expected that 2026 will mark a new starting point for PCBs driven by "technology content to create value."