Veeco Ships Laser Spike Annealing System to Leading Memory Company for Advanced DRAM Evaluation
Veeco Instruments Inc. has shipped its laser spike annealing system to a leading semiconductor memory company for evaluation in advanced DRAM R&D. This marks an expansion in the DRAM market and a step towards potential high-volume manufacturing for next-gen DRAM and HBM technologies. The evaluation will last about a year, with follow-on orders expected in 2027 and beyond.
Veeco Instruments Inc. announced that a leading semiconductor memory company has selected its laser spike annealing (LSA) system for evaluation in advanced DRAM research and development. The evaluation shipment marks an expansion of Veeco’s presence in the DRAM market and is a step toward potential high-volume manufacturing adoption for next-generation DRAM and high bandwidth memory (HBM) technologies. The evaluation period is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Veeco Instruments Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: GNW9592853-en) on December 01, 2025, and is solely responsible for the information contained therein. © Copyright 2025 - Public Technologies (PUBT)
