
Apple In Preliminary Talks With Some Indian Chip Manufacturers To Assemble And Package Component For iPhone - ET
Dec 16 (Reuters) -
* APPLE IS IN PRELIMINARY TALKS WITH SOME INDIAN CHIP MANUFACTURERS TO ASSEMBLE AND PACKAGE THE COMPONENT FOR IPHONE - ET Source text: https://tinyurl.com/4s2wx4xh Further company coverage: (AAPL.O)