SK hynix Unveils Next-Gen AI Memory Solutions at CES 2026
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SK hynix Inc. showcased its next-generation AI memory solutions at CES 2026, featuring the debut of its 16-layer HBM4 with 48 GB, SOCAMM2 low-power memory module, LPDDR6 for on-device AI, and a 321-layer 2 Tb QLC NAND flash for AI data centers. The company also created an ‘AI System Demo Zone’ to illustrate the integration of its memory solutions within the AI ecosystem and promote collaboration with key customers.
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