Cadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners
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Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem to simplify engineering and speed up chiplet development for AI, data centers, and high-performance computing. Collaborating with Samsung Foundry, they aim to demonstrate a silicon prototype of their Physical AI chiplet platform. The initiative includes partners like Arm and others, focusing on efficient adoption of advanced chiplet technologies. This news was generated by Public Technologies and is for informational purposes only.
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