China's Forehope Electronic to Invest USD300 Million to Build IC Packaging, Testing Plant in Malaysia
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Forehope Electronic plans to invest USD300 million to build an integrated circuit packaging and testing plant in Penang, Malaysia. The factory aims to enhance its global market share and strengthen ties with overseas clients. The project is in the preliminary stage, with no details on production capacity yet. Forehope's chip packaging volume increased by 45% in 2024, and overseas revenue rose to USD89.5 million, accounting for 18% of total revenue. Shares of Forehope Electronic rose 0.2% to USD5.97 today, with a 28% increase since the end of last year.
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