Henkel strengthens global innovation and supply chain hub with move to Singapore Science Park

Henkel Singapore has relocated its operations to Geneo at Singapore Science Park, establishing a next‑generation innovation hub that will support customers worldwide. With the move, Henkel brings together its businesses, Adhesives Technology Application Engineering Laboratory, the new Academy of Hair, Global Supply Chain Hub and Adhesive Operations Digital Lab under one roof, the firm said in a statement on Tuesday. “The opening of our new Singapore office underscores Henkel’s commitment to building a strong, future-ready foundation in Asia Pacific. Singapore’s dynamic ecosystem, world-class infrastructure, and robust talent pipeline make it an ideal location for us to accelerate our global ambitions and strengthen our regional presence, “This milestone reflects not only our investment in the region, but also our confidence in Singapore as a strategic hub for innovation, collaboration and long-term growth,” said Mark Dorn, Executive Vice President Adhesive Technologies of the firm. Thomas Holenia, Corporate Vice President Procurement Henkel Adhesive Technologies and President of Henkel Singapore, added that Singapore plays a pivotal role in Henkel’s worldwide operations. “By establishing our hub at ‘Geneo’ Singapore Science Park, our Singapore setup has taken the next step to become a critical control tower for our businesses – where supply chain, innovation and digital capabilities come together, “This will enable us to serve customers across multiple industries more effectively, accelerate new solutions from idea to market and continue to strengthen Henkel’s growth platform in Asia Pacific,” he said. Meanwhile, Lim Wey-Len, Executive Vice President, Singapore Economic Development Board, said as a key hub for specialty chemicals in Asia, Singapore provides the ideal foundation for companies like Henkel to drive regional growth and innovation. “Henkel’s new office will build capabilities in digital operations, supply chain management, advanced electronics packaging, and greener materials, and will also create new opportunities for Singapore talent, “We look forward to deepening our partnership with Henkel to grow our innovation ecosystem for specialty chemicals and advanced materials,” he added. With the expansion of the Adhesives Application Engineering Laboratory, Henkel Singapore now has advanced capabilities to support customers from the general manufacturing, maintenance, industrial and electronics sectors. Central to this is the Henkel SEA Electronic Adhesives Technical Centre, a strategic stronghold for electronics manufacturing which supports customers across Singapore, Malaysia, Indonesia, the Philippines and Thailand in key growth segments such as semiconductors and consumer electronics. As the largest electronic adhesives application engineering laboratory in Southeast Asia, it serves as the regional hub for technical support and application development. It is noted that the Technical Center has recorded consistent year‑on‑year growth, underscoring its vital role in enabling customer programs and regional growth. The new facility at Singapore Science Park offers full material characterization and failure analysis capabilities and will be able to replicate key customer application processes – including dispensing, die attach, lamination, printing and dicing – allowing for more representative testing and faster problem solving for customers. While the Technical Centre remains primarily application‑engineering focused, it is expanding its involvement in advanced development projects, strengthening collaboration with product development teams and accelerating the introduction of new solutions tailored to regional needs. As part of Henkel’s sustainability ambition, the Technical Center is actively benchmarking the adhesion performance of PFAS alternatives against legacy products to support new product launches with reduced environmental impact, while also improving its own footprint through measures such as reducing nitrogen gas consumption with automatic shut‑off valves and implementing water‑usage timers. Henkel also contributes to the regional innovation ecosystem in advanced packaging through its participation in a photonics chiplets consortium led by A*STAR’s Institute of Microelectronics. In this collaboration, Henkel provides its underfill and molding materials expertise and gains insights into integration and reliability requirements for next‑generation computing systems, which in turn inform future customer projects. From its new hub at Singapore Science Park, Henkel also aims to build on this foundation by deepening collaboration with customers and partners, accelerating innovation and advancing more sustainable solutions for the region and beyond. Micron invests $24B to advance wafer fabrication facility in Singapore