<div id="readability-page-1"><p>TAIPEI, April 1 (Reuters) - TSMC, the world's largest contract chipmaker, is expected to launch equipment installation and mass production of 3-nanometre wafers in 2028 at its second factory in Japan, according to a Taiwanese government filing late on Tuesday.</p> <p>In February, TSMC CEO CC Wei said the company plans to mass-produce advanced 3-nanometre chips at its second fabrication plant in Japan, during a meeting with Japan's Prime Minister Sanae Takaichi. </p>    * Under the revised plan, its second chip-making plant inJapan will have a monthly production capacity of 15,000 12-inchwafers through advanced 3-nanometre process technology, thefiling said on Tuesday.    * TSMC's previous plans for Japan focused on theless-advanced technologies. In 2024, the company said that totalinvestment in the first and second fabs would exceed $20billion, with combined monthly production capacity of 100,00012-inch wafers using less-advanced 40, 22/28, 12/16 and6/7-nanometre process technologies.    * Japanese newspaper Yomiuri reported in February thatinvestment for the second fab plant will roughly touch $17billion, but TSMC has not disclosed the figure yet and alsodeclined to comment on the reported investment figure.    * The company's first fab plant in Japan started volumeproduction in late 2024.    * TSMC established its Japan unit, Japan AdvancedSemiconductor Manufacturing, in 2021 with support from SonySemiconductor Solutions Corporation. Japan's DENSO Corporationand Toyota Motor Corporation later joined as minority investors. <p>(Reporting by Wen-Yee Lee; Editing by Sherry Jacob-Phillips)</p></div>

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<p>TSMC plans to launch equipment installation and mass production of 3-nanometre wafers at its second factory in Japan by 2028. The new plant will have a monthly production capacity of 15,000 12-inch wafers using advanced technology. Total investment in both fabs is expected to exceed $20 billion, with the second fab's investment estimated at around $17 billion. TSMC's first fab in Japan began production in late 2024, and the company established its Japan unit in 2021 with support from Sony and other investors.</p>

- TSMC plans to begin equipment installation and mass production of 3-nanometre wafers at its second factory in Japan by 2028, as indicated in a recent Taiwanese government filing.  
- The facility is expected to achieve a production capacity of 15,000 12-inch wafers monthly using advanced technology, differing from previous plans centered on less-advanced processes.  
- Overall investment in TSMC's first and second fabs in Japan is projected to exceed $20 billion, with the second fab's investment reportedly around $17 billion, although TSMC has not confirmed this figure.

TSMC plans 3-nanometre chip production launch in Japan in 2028