PingWan reported on April 9th that Apple is accelerating its self-developed AI hardware layout and has begun testing advanced glass substrate samples provided by Samsung Electro-Mechanics. This move aims to support the self-developed AI server chip project codenamed &#34;Baltra,&#34; which is expected to be manufactured by TSMC using the 3-nanometer N3E process and will adopt a chiplets architecture.
This testing demonstrates Apple's strong strategy in supply chain control. Although Apple is collaborating with Broadcom to develop the chip, it has chosen to bypass intermediaries and directly assess the procurement of key substrate materials from Samsung Electro-Mechanics. Industry observers believe this is to control packaging quality from the end-user perspective and indicates Apple's intention to gradually internalize the packaging decision-making power of AI server chips through vertical integration.
The Baltra chip is expected to be first deployed in Apple's Private Cloud Infrastructure (PCC) to reduce reliance on NVIDIA GPUs and optimize data center costs. Samsung Electro-Mechanics is fully promoting the mass production of glass substrates, with its pilot line in Sejong now operational, aiming for large-scale production after 2027

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Apple is testing glass substrate samples provided by Samsung Electro-Mechanics to advance its self-developed AI server chip project "Baltra." The chip is expected to be manufactured by TSMC using a 3-nanometer process and will adopt a chiplet architecture. Apple's choice to source key materials directly from Samsung demonstrates its strong strategy in supply chain management. The Baltra chip will be prioritized for deployment in Apple's private cloud infrastructure to reduce reliance on NVIDIA GPUs. Samsung Electro-Mechanics plans to achieve mass production of glass substrates after 2027

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Apple tests Samsung glass substrates to advance self-developed AI server chip Baltra