Since 2026, the advanced packaging field of semiconductors has ushered in structural opportunities, with glass-based packaging becoming one of the hottest tracks in the capital market due to its core performance advantages suited for AI chips. In this material transformation driven by the explosion of AI computing power, the two major panel giants, BOE and TCL Technology, have recently clarified their layout actions, officially opening a new battlefield for the panel industry to cross into semiconductor packaging.
The core driving force behind this round of glass-based packaging craze comes from the urgent demand for high-end packaging technology in the AI industry.
As the parameters of large models evolve towards the trillion-level scale, Moore's Law is gradually approaching physical limits. Traditional organic substrates have gradually reached physical limits in terms of heat dissipation efficiency, large-size processing stability, and interconnection density. In contrast, glass substrates are regarded as the &#34;next-generation key material&#34; to replace existing silicon interlayers and organic substrates due to their low thermal expansion coefficient, high flatness, low warpage, and excellent high-frequency electrical performance. As an insulator, glass has far lower signal loss in high-frequency applications compared to silicon-based materials, which is significant for solving the data transmission bottleneck of AI chips.
Market data confirms this explosive heat. According to data from the technology market research and consulting firm Omdia, the global glass substrate market is expected to reach USD 18.6 billion by 2026 and is projected to exceed USD 32 billion by 2030, with a compound annual growth rate of 14.5%. At the same time, research institutions generally predict that 2026 will be a key node for small-batch commercialization shipments of glass substrates, with a rapid growth period expected from 2028 to 2030. The international authoritative market research firm Yole Group previously released a report stating that from 2025 to 2030, the compound annual growth rate of semiconductor glass wafer shipments will exceed 10%.
From a technical path perspective, the core of glass-based packaging lies in Through Glass Via (TGV) technology. Simply put, it involves drilling micron-level vertical vias in specially designed glass substrates and filling them with metal, thereby constructing the shortest electrical signal transmission path between chips.
Compared to the currently mainstream silicon via (TSV) solutions, glass substrates have three core advantages: First, faster signals. Glass is a high-quality insulator with extremely low signal loss at high frequencies, significantly improving transmission speed and reducing power consumption. Second, it is not afraid of heat. The thermal expansion coefficient of glass can be adjusted according to chip requirements, perfectly matching large-size AI chips and fundamentally solving the industry pain point of packaging warpage. Third, it is suitable for large sizes. The glass forming process supports the production of large-size panels, and in experiments with 510mm×515mm board-level packaging, the warpage of glass substrates is reduced by more than 50% compared to organic substrates, paving the way for future higher-density chip integration.
Semiconductor display companies such as TCL Technology and BOE have a deep technical accumulation in glass substrate manufacturing, large-area precision processing, and display panel processes, which are highly compatible with the TGV process and large-area substrate processing technology required for glass-based packaging, providing a natural advantage for rapid technological transformation
In the face of this future track, the two panel giants have shown a proactive layout attitude. BOE recently announced the signing of a three-year memorandum of cooperation with global glass materials giant Corning, focusing on cooperation in key areas such as glass-based packaging substrates and foldable glass, with glass-based packaging substrates being the core focus.
TCL Technology is also maintaining a high level of attention. In response to investors' questions about &#34;glass-based packaging technology reserves and whether to follow up on entering the track,&#34; on May 25, TCL Technology replied on Interactive Easy that the company is currently in the preliminary research and technical pre-research stage in the field of glass-based packaging, revealing a strategic attitude of actively following up.
Industry analysts believe that, with the explosive demand for AI computing power, the actions of China's panel giants in the field of glass-based packaging signify that China's semiconductor materials industry chain is ushering in a new round of value reassessment. With continuous technological iteration and major players increasing their layouts, glass-based packaging is expected to reach a mass production inflection point between 2026 and 2028, and leading panel companies like BOE and TCL Technology that have positioned themselves early are likely to become the core beneficiaries of the industry dividend, driving China to achieve a leapfrog in the global advanced packaging field

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BOE and TCL TECH. are laying out their strategies in the glass-based packaging field, and are expected to become leading companies in the chain. As the demand for high-end packaging technology increases in the AI industry, glass substrates are seen as a key alternative to traditional materials due to their superior performance. Market forecasts predict that the global glass substrate market will reach USD 18.6 billion by 2026 and exceed USD 32 billion by 2030, with a compound annual growth rate of 14.5%

The panel giants BOE and TCL TECH. are expected to become leading companies in the glass-based packaging field