As of June 1, 2026, 9:35 AM, the Huaxia Sci-Tech Semiconductor ETF (588170) fell by 2.45%, and the Huaxia Semiconductor Equipment ETF (562590) decreased by 2.47%. Among popular individual stocks, the performance was mixed, with China Shipbuilding Industry Corporation leading the gain at 7.07%, Jinhong Gas rising by 2.74%, and Huaxing Yuanchuang increasing by 2.24%; while Hu Silicon Industry led the decline at 5.49%, Shengmei Shanghai dropped by 5.26%, and Zhongwei Company fell by 4.93%.
In news, the Indian government announced that chip giant Intel and 3D Glass Solutions (3DGS) will invest approximately $3.3 billion (about RMB 22.3 billion) to establish a semiconductor substrate manufacturing plant in the eastern state of Odisha. It is reported that the factory is planned to be completed in five to six years and will be located in the Bhubaneswar-Khurda area, focusing on producing glass substrates for advanced packaging technology, high-density interconnect substrates, and other related semiconductor technologies. The Indian government has committed to providing billions of dollars in subsidies, which may create over 1,800 direct high-skilled jobs.
Related ETFs: Huaxia Sci-Tech Semiconductor ETF (588170) and its linked funds (Class A: 024417; Class C: 024418): The tracking index is the only semiconductor equipment thematic index on the Sci-Tech Innovation Board, with nearly 80% of the content in memory chips and the highest proportion of advanced packaging in the entire market (about 59%), focusing on hardcore equipment companies at the forefront of technological innovation.
Huaxia Semiconductor Equipment ETF (562590) and its linked funds (Class A: 020356; Class C: 020357): The tracking index is the CSI Semiconductor Material Equipment Thematic Index, with the highest proportion of semiconductor equipment in the entire market index (about 63%), directly benefiting from the global chip price surge and the certainty of demand for &#34;shovel sellers&#34; (equipment manufacturers)

INTC

688146

688126

Intel and 3D Glass Solutions announced an investment of approximately 22.3 billion yuan to establish a semiconductor substrate manufacturing plant in Odisha, India, expected to be completed in 5-6 years, primarily producing glass substrates for advanced packaging. Affected by this news, related ETFs showed mixed performance during trading, with the ChinaAMC Semiconductor ETF down 2.45% and the ChinaAMC Semiconductor Equipment ETF down 2.47%. In terms of individual stocks, there were mixed results, with PERIC leading the gains and NSIG leading the losses

- As of June 1, 2026, the Kechuang Semiconductor ETF Huaxia (588170) and the Semiconductor Equipment ETF Huaxia (562590) saw declines of 2.45% and 2.47%, respectively.  
- The Indian government announced a $3.3 billion investment by Intel and 3D Glass Solutions to build a semiconductor substrate manufacturing plant in Odisha, which aims to create over 1,800 high-skilled jobs with substantial subsidies.  
- Related ETFs focus on key semiconductor themes, with the Kechuang Semiconductor ETF primarily tracking storage chips and advanced packaging, while the Semiconductor Equipment ETF emphasizes semiconductor equipment benefits amid rising chip prices.

同壁财经

Intel

PERIC

NSIG

INTEL-T

Guotai CES Semiconductor Chip Industry ETF

GraniteShares 2x Long INTC Daily ETF

SPDR S&P Semicon

iShares Semiconductor ETF

Direxion Semicon Bull 3X

GTJA Allianz CSI All Share Semiconductors & Semiconductor Equipment ETF

Roundhill Memory ETF

GTJA Allianz SSE STAR Chip Design Thematic ETF

Guotai CSI Semiconductor Material Equipment Theme ETF

ChinaAMC SSE STAR Semiconductor Material & Equipment Thematic ETF

VanEck Semiconductor ETF

ChinaAMC CSI Semiconductor Material & Equipment Thematic ETF

JINHONG GAS

ACMSH

AMEC

Invest another 20 billion! Intel teams up with seasoned players to increase investment in glass substrates; semiconductor sector experiences intraday pullback