Singapore’s Silicon Box secures $78M financing to accelerate growth in advanced packaging

Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital. The facility includes an option to upsize by an additional $75 million, Silicon Box said in a statement. The financing follows closely on the company’s recently completed $150 million Series B2 equity round, further strengthens Silicon Box’s capital structure to support its next phase of growth, and accelerates the global deployment of its advanced packaging solutions. With a strengthened balance sheet following the combined debt and equity financing, Silicon Box said it is well-positioned to expand manufacturing capacity, support increasing customer demand, and further its leadership in advanced packaging for sectors such as artificial intelligence (AI), high-performance computing (HPC), mobile, Internet of Things (IoT), robotics, and space tech. “In capital-intensive industries like semiconductor manufacturing, access to flexible and scalable funding is critical to capturing growth opportunities. The proceeds will be deployed for capacity expansion to meet the rapidly growing market demand,” said Dr. BJ Han, Co-founder and Chief Executive Officer of Silicon Box. “This financing enhances our capital base while minimising shareholder dilution, and we are pleased to partner with Ares, InnoVen, Abound, and January Capital, “Their support reinforces confidence in our strategy and enables us to execute on our global expansion plans,” he added. As traditional monolithic scaling approaches physical and economic limits, Silicon Box said its proprietary SiPlet technology and panel-level packaging solutions are addressing critical bottlenecks in next-generation semiconductor design. Since its first high-volume manufacturing announcement last year, the firm, as of the first quarter of 2026, has achieved significant commercial traction, including the shipment of over 250 million units at near-perfect yield from its flagship Singapore manufacturing facility. “We are pleased to support Silicon Box in this next phase of growth. The company has demonstrated strong execution capabilities and operates at the leading edge of advanced packaging – a strategically important segment of the semiconductor value chain, “We believe that Silicon Box is well-positioned to scale globally, and this financing reflects our confidence in the management team and the long-term growth outlook for advanced packaging,” said Dinesh Goel, Partner at Ares. Sea stands out as AI transforms ASEAN digital economy – Maybank