- ASMPT has seen a significant surge in its TC bonding machine revenue, increasing by 146% year-over-year, driven by early orders for the sixth generation of high bandwidth memory (HBM4).
- The company expects a 40% rise in orders in the first quarter of this year, contributing to a growing market, projected to reach $1.6 billion by 2028, with a target market share of 35-40%.
- Ongoing patent disputes in the semiconductor sector may accelerate supplier diversification among HBM customers, potentially benefiting ASMPT's market position.
