Conference Report: System Level Thinking Needed in AI Era
SemiConductor·
- OpenAI hardware chief Richard Ho stated at the 2026 Symposium on VLSI Technology and Circuits that compute, memory, and interconnect must be co-optimized as a system.
- Industry leaders outlined technological roadmaps, including gate-all-around transitions, High-NA lithography, and advanced packaging like TSMC's 14x reticle CoWoS.
- SK hynix reported that data centers consume 70 % of global DRAM output, signaling potential structural undersupply driven by real AI demand.