Laura Peters from @SemiEngineering talks about the latest trends discussed at #ECTC. A few things stood out:
· "Chip Manufacturing and Assembly/Packaging are only going to get closer and closer"· RE: Hybrid Bonding - a major issue still not solved is metrology. Keep an eye on $KLA(KLAC.US) $Onto Innovation(ONTO.US) $Camtek(CAMT.US)· The industry seems to have coalesced around Liquid Cooling to deal with large sever thermal issues.Source: Chips & Wafers
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