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KLA
KLAC.US
KLA Corporation, together with its subsidiaries, designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. The company operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. It offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. The company also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry.
1.236 T
KLAC.USMarket value -Rank by Market Cap -/-

Financial Score

22/12/2025 Update
B
Semiconductor Materials and EquipmentIndustry
Industry Ranking4/34
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
  • Criteria
    Rating
  • Profit ScoreA
    • ROE99.17%A
    • Profit Margin33.83%A
    • Gross Margin61.27%A
  • Growth ScoreB
    • Revenue YoY22.11%A
    • Net Profit YoY42.83%B
    • Total Assets YoY4.06%C
    • Net Assets YoY40.04%A
  • Cash ScoreB
    • Cash Flow Margin295.61%C
    • OCF YoY22.11%A
  • Operating ScoreB
    • Turnover0.78B
  • Debt ScoreD
    • Gearing Ratio69.45%D

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    News
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    SEMI: Global semiconductor equipment sales will hit US$145 billion in 2026, after rising 13.7% to a record high $133 B this year, driven by AI-related spending in leading-edge logic and memory chip ma...

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    TSMC mass production of 2nm chips heralds a new era of chip manufacturing marked by a fundamental change in basic transistor structure to new GAA transistors – from FinFETs – that requires an upgrade ........................

    Advanced packaging has become a meaningful number in WFE (up to 9-10% in CY25 vs 1-2% in CY21). $11B in CY25 from $3-$4B in CY21. KLA's AP revenue will grow by 70% to $925M in CY25 from $500M+ in CY24...

    TSMC’s certainty over capacity needs now extends 2-years out instead of one, media report, as the chip giant now engages contractors for new chip fabs or packaging plants 2-years ahead of time instead.....................

    TSMC plans to build three more 2nm fabs in Tainan, south Taiwan, on top of the seven already planned for Hsinchu and Kaohsiung, media report, as it scrambles to keep up with runaway demand for AI chip.................................