ASE plans to invest NT$4.01 billion (US$130 million) to build a new advanced semiconductor packaging plant, K18B, in Kaohsiung, south Taiwan, media report, a facility with 2 underground floors, and 8 above ground with total floor area of 18,300-ping (21,500 square feet). $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US) $Broadcom(AVGO.US) $NVIDIA(NVDA.US) $AMD(AMD.US) #semiconductors #semiconductor
Source: Dan Nystedt
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