Rumor: Nvidia is working with ASE subsidiary SPIL to develop CoWoP (Chip on Wafer on PCB) advanced chip packaging, media report, noting CoWoP will reduce costs and supply constraints by doing away with the silicon interposer in favor of PCB (printed circuit board) material, which is cheap and plentiful. PCB makers including ZDT, Unimicron, Compeq of Taiwan, and some top-tier China makers are in the process of submitting samples for the project. $NVIDIA(NVDA.US) $Advanced Semiconductor Engineering(ASX.US) #Semiconductors #cowop
Source: Dan Nystedt
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