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Advanced Semiconductor Engineering
ASX.US
ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It operates through Packaging, Testing, EMS, and Others segments. The company offers semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users; wire bonding, including lead frame and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services.
9.526 T
ASX.USMarket value -Rank by Market Cap -/-

Financial Score

14/12/2025 Update
B
SemiconductorsIndustry
Industry Ranking13/84
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
  • Criteria
    Rating
  • Profit ScoreB
    • ROE11.26%B
    • Profit Margin5.60%C
    • Gross Margin17.13%D
  • Growth ScoreB
    • Revenue YoY7.33%B
    • Net Profit YoY9.57%C
    • Total Assets YoY22.15%A
    • Net Assets YoY6.24%B
  • Cash ScoreB
    • Cash Flow Margin1786.14%B
    • OCF YoY7.33%B
  • Operating ScoreB
    • Turnover0.81B
  • Debt ScoreD
    • Gearing Ratio59.70%D

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    News
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    November sales by Taiwan stock market listed companies rose 17% year-on-year to total NT$4.67 trillion (US$149.7 billion), the second highest ever and up 0.68% from October, media report. The record h...

    ..............................

    ASE Technology’s advanced packaging revenue will grow 60% in 2026 to around US$2.6 billion, from $1.6 billion this year, media report, adding its CoWoS-rival technology, FOCoS (Fan-Out Chip-on-Substra.........

    TSMC’s overflow of CoWoS advanced packaging orders is turning into a bonanza for ASE Technology, via outsourcing, media report, noting ASE and subsidiary, SPIL, have spent NT$11.2 billion (US$360 M) t............

    Rumor: Nvidia is working with ASE subsidiary SPIL to develop CoWoP (Chip on Wafer on PCB) advanced chip packaging, media report, noting CoWoP will reduce costs and supply constraints by doing away wit.........

    Nvidia, Foxconn and ASE are among companies that have invested in Taiwan industrial parks this year, media report, adding the Bureau of Industrial Parks has won 166 investments worth NT$174.5 billion .........