Taiwan’s semiconductor equipment makers are expected to produce NT$200 billion (US$6.4B) worth of machinery in 2026, up from NT$180B in 2025, the economics ministry said, media report, with the ministry to invest NT$5B over 5-years on R&D for new technology like panel-level-packaging (PLP) and silicon photonics (SiPh). The ministry has promoted the development of 29 categories of chip equipment to date by aligning efforts with the needs of manufacturers like TSMC and ASE. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductors
Source: Dan Nystedt
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